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产品类型	Package(s)	Density	Organization	Voltage	Temp	Speed	Comment	Package	Status	RoHS
筛选条件	All SOIC8 208mil, SOIC16 300mil,WSON 8x6mm, PDIP8 300mil SOIC8 150mil,SOIC8 208mil,SOIC16 300mil,WSON 6X5mm,PDIP8 300mil SOIC8 150mil,SOIC8 208mil,SOIC16 300mil,WSON 6X5mm,PDIP8 300mil TFBGA24 6X8mm	All 1Gb 128 Mbit 256 Mbit 512 Mbit 32 Mb 64 Mb 4Mbit 128 Mb 32Mbit 16 Mb 256 Mb 64Mbit 64Mbit(8MB) 16Mbit(2MB) 16Mbit 128Mbit	All 512K x 8 4M x 8/2M x 16 32768 pages,4KB sectors,32/64KB blocks,Dual/Quad-SPI 64Mbit x16 64Mbitx16/8 Banks 8Mbitx32/4 Banks 8Mbit x16 8Mbit x16/4 Banks 1Mbit x16 1Mbit x16/2 Banks 128Mbitx8/8 Banks 8Mbitx16/4 Banks 4Mbitx16/4 Banks 16Mbit x16/4 Banks 4Mbit x16/4 Banks 16Mbitx16 16Mbitx16/4 Banks 32Mbitx16 32Mbitx16/4 Banks 2Mbit x32 2Mbit x32/4 Banks 4Mbit x16 16Mbitx8/4 Banks 1Mbit x16 4Mbitx32/4 Banks 32Mbitx8 32Mbitx8/4 Banks 4Mbit x32 256Mbitx8/8 Banks 64Mbitx8 64Mbitx8/4 Banks 2Mbit x32 128Mbitx16/8 Banks 4Mbit x32 x32 x16 X16 X32 8M x 8/4M x 16 2M x 8/1M x 16 8192 pages,4KB sectors,32/64KB blocks,Dual/Quad SPI,QPI,Enhanced 8192 pages,4KB sectors,32/64KB blocks,Dual/Quad-SPI Enhanced 8192 pages,4KB sectors,32/64KB blocks,Dual/Quad-SPIEnhanced** 16M x 8/8M x 16 32Mbit x32	All 3.3V 1.8/1.8V 1.8V±0.1V 3.3V±0.3V 2.7V~3.6V 1.5V±0.075V 2.5V ±0.1V 2.5V±0.2V 2.6V±0.1V 3V/3.3V 2.4V~2.7V 2.6V ±0.1V 2.5V ±0.2V 2.5V ±0.2V 2.6V ±0.1V 3.3V±0.3V 2.7V~3.6V 2.7V - 3.6V 2.4V~2.7V 2.5V ±0.2V 1.8V ± 0.1V 1.65V - 1.95V 2.3V - 3.6V 1.8V / 1.8V	All 0 to +70 -20 to +85 —40 to+85 -40 to+85 -40 to +85 —40 to+85,—40 to+105 -40 to+85,-40 to+105	All 33MHz 70ns —18/533MHz 90ns -5_200MHz_CL3 -5_143MHz_CL2 -4_250MHz_CL3, -5/-5I_200MHz_CL3, -6/-6I_16MHz_CL2.5 7/7/7,5-5-5/6-6-6,5/5/5 -6_166MHz_CL3 -6/-6I_166MHz_CL3, -7_143MHz_CL3 80MHz(160/320MHzDual/Quad-SPI) 80MHz(160/320MHz Dual/Quad-SPI) -6/-6I/-6A_166MHz_CL3, -75_133MHz_CL3 -5_200MHz_CL3, -6/-6C/-6I/-6A_166MHz_CL3, -75_133MHz_CL3 (-5/-5I)_200MHz_CL3 -4_250MHz_CL3/CL4, -5/-5I_200MHz_CL3 50MHz (100/200MHz Dual/Quad-SPI) 50MHz(100/200MHz Dual/Quad-SPI) 80/104MHz(160/320MHzDual/Quad-SPI) 80/104MHz(160/320MHz Dual/Quad-SPI) -6C_166MHz_CL3, -6/-6I/-6A_166MHz_CL3, -75_133MHz_CL3	All RecommendW25Q64C Recommend W25Q64FV for new designs Samples Available	All PLCC 32/STSOP 32 TSOP48/- PLCC 32 STSOP 32 WBGA-84 WBGA 84 Ball (8x12.5mm2), using Lead free materials with RoHS compliant WBGA-136 TFBGA 128 Ball (10.5X13.5 mm2), using Lead free materials with RoHS compliant TSOP II 54-pin, 400 mil using Lead free with RoHS compliant Package in 50-pin, 400 mil TSOP II, using Lead free materials with RoHS compliant Packaged in WBGA 78 Ball (8x10.5mm2), using Lead free materials with RoHS compliant Packaged in TSOP II 66-pin, using Lead free materials with RoHS compliant Packaged in TSOP II 54-pin, 400 mil - 0.80, using Lead free materials with RoHS compliant Packaged in TFBGA 54 balls, using Lead free materials with RoHS compliant WBGA 84 Ball (8X12.5 mm²), using Lead free materials with RoHS compliant WBGA 84 Ball (8X12.5 mm2), using Lead free materials with RoHS compliant Packaged in TFBGA 90 ball(8x13mm² ), using Lead free materials with RoHS compliant Packaged in TFBGA 90 ball(8x13mm2 ), using Lead free materials with RoHS compliant Packaged in TSOP II 54-pin, 400 mil using Lead free materials with RoHS compliant Packaged in VFBGA 60 balls, using Lead free materials with RoHS compliant Packaged in WBGA 96 Ball (9x13mm2), using Lead free materials with RoHS compliant WBGA 60 Ball (8x12.5mm2), using Lead free materials with RoHS compliant Packaged in TFBGA 54 Ball(8x8mm2 ), using Lead free materials with RoHS compliant Packaged in VFBGA 60 balls pitch=0.65mm, using Lead free materials with RoHS compliant Packaged in 144L LFBGA, using Lead free materials with RoHS compliant WBGA 60 Ball (8X12.5 mm2), using Lead free materials with RoHS compliant Packaged in TFBGA 90 Ball(8x13mm² ), using Lead free materials with RoHS compliant Packaged in TFBGA 90 Ball(8x13mm2 ), using Lead free materials with RoHS compliant 90 Balls TFBGA, using Lead free materials with ROHS compliant Packaged in 60 Ball(8x13mm2)TFBGA, using Lead free materials with RoHS compliant TSOP II 54-pin, 400 mil using Lead free materials with RoHS compliant Packaged in TFBGA 54 Ball(8x8mm2), using Lead free materials with RoHS compliant Packaged in 60 Ball TFBGA, using lead free materials with RoHS compliant WBGA 60 Ball (11x11.5mm2), using Lead free materials with RoHS compliant WBGA 60 Ball (8X12.5 mm²), using Lead free materials with RoHS compliant 90VFBGA 60VFBGA KGD 54VFBGA N/A TSOP 56/LFBGA 64/TSOP 48/TFBGA 48 TSOP 56?/LFBGA 64?/TSOP 48/TFBGA 48 TSOP 56/LFBGA 64 SOIC8 208mil, SOIC16 300mil,WSON 8x6mm, PDIP8 300mil SOIC8 150mil,SOIC8 208mil,SOIC16 300mil,WSON 6X5mm,PDIP8 300mil SOIC8 150mil,SOIC8 208mil,SOIC16 300mil,WSON 6X5mm, PDIP8 300milTFBGA24 6X8mm Packaged in TSOP II 86-pin, using Lead free materials with RoHS compliant WBGA 84 Ball (11x13mm2), using Lead free materials with RoHS compliant	All NRFND EOL S P UD (Q3/’08) UD (Q2/’08) Contact us	All Y -
W25Q16CL	SOIC8 150mil,SOIC...	16Mbit(2MB)	8192 pages,4KB se...	1.65V - 1.95V	—40 to+85	50MHz (100/200MHz...	Samples Available...	SOIC8 150mil,SOIC...	P	Y
W25Q16CV	SOIC8 150mil,SOIC...	16Mbit(2MB)	8192 pages,4KB se...	2.7V - 3.6V	—40 to+85,—40 to+...	80/104MHz(160/320...	Samples Available...	SOIC8 150mil,SOIC...	P	Y
W25Q64BV	SOIC8 208mil, SOI...	64Mbit(8MB)	32768 pages,4KB s...	2.7V - 3.6V	—40 to+85	80MHz(160/320MHzD...	RecommendW25Q64C	SOIC8 208mil, SOI...	NRFND	Y
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