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产品类型 形状 最少供货数-Nom 保存温度范围-Min 阻抗容差-Min 使用温度范围-Min 阻抗-Nom 阻抗容差-Max 最少包装数-Nom 工艺 包装形式 使用温度范围-Max 保存温度范围-Max 适用焊接方法 电路数-Nom 材质名称 阻抗测定频率-Nom 额定电压-Max 绝缘电阻-Min 表面安装分类 阻抗-Min 主体纵长(W)-Nom 主体高度(T)-Nom 重量-Nom 主体横宽(L)-Nom 额定电流-Max 直流电阻-Max 尺寸代码
筛选条件
Chip 500Pcs -40Cel -25% -25Cel 400Ohm 25% 500Pcs MULTI-LAYER Blister (Plastic)... 85Cel 85Cel Reflow,Iron Solde... 1 100 MHz Yes 5 mm 3.2 mm 0.454g 5.7 mm 3A 0.04Ohm 5750
Chip 300Pcs -40Cel -25% -25Cel 600Ohm 25% 300Pcs MULTI-LAYER Blister (Plastic)... 85Cel 85Cel Reflow,Iron Solde... 1 100 MHz Yes 5 mm 4.74 mm 0.711g 6.4 mm 3A 0.04Ohm 6350
Chip 2000Pcs -40Cel -25% -25Cel 10Ohm 25% 2000Pcs MULTI-LAYER Blister (Plastic)... 85Cel 85Cel Reflow,Iron Solde... 1 100 MHz Yes 1.25 mm 0.9 mm 0.01g 2 mm 0.6A 0.1Ohm 2012
Chip 2000Pcs -40Cel -25% -25Cel 26Ohm 25% 2000Pcs MULTI-LAYER Blister (Plastic)... 85Cel 85Cel Reflow,Iron Solde... 1 100 MHz Yes 1.6 mm 1.1 mm 0.022g 3.2 mm 0.5A 0.2Ohm 3216
Chip 2000Pcs -40Cel -25% -25Cel 52Ohm 25% 2000Pcs MULTI-LAYER Blister (Plastic)... 85Cel 85Cel Reflow,Iron Solde... 1 100 MHz Yes 2.5 mm 1.3 mm 0.046g 3.2 mm 0.4A 0.3Ohm 3225
Chip 1000Pcs -40Cel -25% -25Cel 120Ohm 25% 1000Pcs MULTI-LAYER Blister (Plastic)... 85Cel 85Cel Reflow,Iron Solde... 1 100 MHz Yes 3.2 mm 1.5 mm 0.094g 4.5 mm 0.3A 0.4Ohm 4532
Chip 2000Pcs -40Cel -25% -25Cel 10Ohm 25% 2000Pcs MULTI-LAYER Blister (Plastic)... 85Cel 85Cel Reflow,Iron Solde... 1 100 MHz Yes 1.25 mm 0.9 mm 0.01g 2 mm 1.5A 0.03Ohm 2012
Chip 2000Pcs -40Cel -25% -25Cel 26Ohm 25% 2000Pcs MULTI-LAYER Blister (Plastic)... 85Cel 85Cel Reflow,Iron Solde... 1 100 MHz Yes 1.6 mm 1.1 mm 0.022g 3.2 mm 1.5A 0.04Ohm 3216
Chip 2000Pcs -40Cel -25% -25Cel 52Ohm 25% 2000Pcs MULTI-LAYER Blister (Plastic)... 85Cel 85Cel Reflow,Iron Solde... 1 100 MHz Yes 2.5 mm 1.3 mm 0.046g 3.2 mm 1.5A 0.05Ohm 3225
Chip 1000Pcs -40Cel -25% -25Cel 120Ohm 25% 1000Pcs MULTI-LAYER Blister (Plastic)... 85Cel 85Cel Reflow,Iron Solde... 1 100 MHz Yes 3.2 mm 1.5 mm 0.094g 4.5 mm 1.5A 0.05Ohm 4532
Chip 500Pcs -40Cel -25% -25Cel 150Ohm 25% 500Pcs MULTI-LAYER Blister (Plastic)... 85Cel 85Cel Reflow,Iron Solde... 1 100 MHz Yes 5 mm 1.8 mm 0.25g 5.7 mm 3A 0.04Ohm 5750
Chip 500Pcs -40Cel -25% -25Cel 300Ohm 25% 500Pcs MULTI-LAYER Blister (Plastic)... 85Cel 85Cel Reflow,Iron Solde... 1 100 MHz Yes 5 mm 3.2 mm 0.454g 5.7 mm 3A 0.04Ohm 5750
Chip 300Pcs -40Cel -25% -25Cel 500Ohm 25% 300Pcs MULTI-LAYER Blister (Plastic)... 85Cel 85Cel Reflow,Iron Solde... 1 100 MHz Yes 5 mm 4.74 mm 0.711g 6.4 mm 3A 0.04Ohm 6350
Chip-Array 4000Pcs -40Cel -25% -40Cel 1000Ohm 25% 4000Pcs MULTI-LAYER Punched (Paper)Ta... 85Cel 85Cel Reflow,Iron Solde... 2 A 100 MHz 5V 1 MOhm Yes 750Ohm 1 mm 0.85 mm 0.004g 1.25 mm 0.05A 0.75Ohm 1210
Chip-Array 4000Pcs -40Cel -25% -40Cel 120Ohm 25% 4000Pcs MULTI-LAYER Punched (Paper)Ta... 85Cel 85Cel Reflow,Iron Solde... 2 A 100 MHz 5V 1 MOhm Yes 90Ohm 1 mm 0.5 mm 0.004g 1.25 mm 0.5A 0.2Ohm 1210
Chip-Array 4000Pcs -40Cel -25% -40Cel 220Ohm 25% 4000Pcs MULTI-LAYER Punched (Paper)Ta... 85Cel 85Cel Reflow,Iron Solde... 2 A 100 MHz 5V 1 MOhm Yes 165Ohm 1 mm 0.85 mm 0.004g 1.25 mm 0.35A 0.3Ohm 1210
Chip-Array 4000Pcs -40Cel -25% -40Cel 90Ohm 25% 4000Pcs MULTI-LAYER Punched (Paper)Ta... 85Cel 85Cel Reflow,Iron Solde... 2 A 100 MHz 5V 1 MOhm Yes 67.5Ohm 1 mm 0.5 mm 0.0025g 1.25 mm 0.5A 0.2Ohm 1210
Chip 20000Pcs -55Cel -50% -55Cel 10Ohm 50% 20000Pcs multilayer type Punched (Paper)Ta... 125Cel 125Cel Reflow 1 S 100 MHz Yes 5Ohm 0.2 mm 0.2 mm 0.00008g 0.4 mm 0.5A 0.1Ohm 0402
Chip 20000Pcs -55Cel -25% -55Cel 120Ohm 25% 20000Pcs multilayer type Punched (Paper)Ta... 125Cel 125Cel Reflow 1 S 100 MHz Yes 90Ohm 0.2 mm 0.2 mm 0.00008g 0.4 mm 0.21A 0.7Ohm 0402
Chip 20000Pcs -55Cel -25% -55Cel 150Ohm 25% 20000Pcs multilayer type Punched (Paper)Ta... 125Cel 125Cel Reflow 1 S 100 MHz Yes 112.5Ohm 0.2 mm 0.2 mm 0.0001g 0.4 mm 0.2A 0.7Ohm 0402