| 产品类型 |
2nd Level Interconnect |
Application/Qualification Tier |
Class |
Die Technology |
Export Control Classification Number (US) |
Frequency (Max) (MHz) |
Frequency Band (Min-Max) (MHz) |
Harmonized Tariff (US) Disclaimer |
Life Cycle Description (code) |
Material Composition Declaration (MCD) |
Micron Size (μm) |
Peak Package Body Temperature (PPT)(°C) |
Pin/Lead/Ball Count |
RoHS Certificate of Analysis (CoA) |
Sample Exception Availability |
Supply Voltage (Typ) (V) |
Tape |
Minimum Package Quantity (MPQ) |
POQ Container |
Floor Life |
Matching |
Moisture Sensitivity Level (MSL) |
P1dB (Typ) (W) |
Test Signal |
Leadtime (weeks) |
Package Material |
Mounting Style |
Wideband Efficiency (Typ) (%) |
Wideband Frequency (Min-Max) (MHz) (f) |
Gain (Typ) (dB) |
Output Power (Typ) (W) (P1dB) |
3rd Order Intercept (Typ) (dBm) |
Intermodulation Distortion - IMD (Typ) (dBc) |
Noise Figure (Typ) (dB) @ f (MHz) |
Output Power (Typ) (dBm) @ f (MHz) |
P1dB (Typ) (dBm) |
Supply Current (Typ) (mA) |
Last Order Date |
Last Ship Date |
Efficiency (Min) (%) |
Halogen Free |
Intermodulation Distortion - IM3 (Typ) (dBc) |
Material Type |
Maximum Time at Peak Temperature (s) |
MPQ Container |
Number of Reflow Cycles |
REACH SVHC |
RoHS technical exemption(s) |
UL94 (plastics flammability test) |
Description |
Package Width (nominal) (mm) |
Preferred Order Quantity (POQ) |
Application |
Thermal Resistance (Spec) (°CW) |
Budgetary Price($US) |
Status |
Tape & Reel |
Part Number |
Device Weight (g) |
Peak Package Body Temperature (PPT)(°C) |
Package Length (nominal) (mm) |
Package Thickness (nominal) (mm) |
Package Description and Mechanical Drawing |
Pb-Free |
Efficiency (Typ) (%) |
Power Gain (Typ) (dB) @ f (MHz) |
Output Power (Typ) (W) @ Intermodulation Level at Test Signal |
Device Sample Availability |
Device Production Availability |