The multi-chip LIN System-in-Package (SiP) is designed for LIN-bus node applications, supporting highly integrated solutions for in-vehicle LIN networks. The first LIN-system-basis-chip (LIN-SBC), ATA6624, has an integrated LIN transceiver, 5V to 7V regulator and window watchdog. The second chip contains the Atmel AVRATmega168 automative microcontroller with advanced RISC architecture and 16 Kbytes flash.All pins of the LIN-SBC and the microcontroller are bonded out to provide customers the same flexibility for their applications as they have when using discrete parts.