系列 |
HC16 |
核心处理器 |
CPU16 |
芯体尺寸 |
16-Bit |
速度 |
16MHz |
RAM容量 |
1K x 8 |
程序存储器类型 |
ROMless |
输入/输出数 |
16 |
振荡器型 |
Internal |
数据转换器 |
A/D 8x10b |
连通性 |
EBI/EMI, SCI, SPI |
工作电压 |
2.7 V ~ 5.5 V |
工作温度 |
-40°C ~ 85°C |
周边设备 |
POR, PWM, WDT |
Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
I/O Pins |
16 |
Budgetary Price($US) |
10000 @ $10.00 each |
Leadtime (weeks) |
6 |
Package Material |
Plastic |
POQ Container |
BOX |
Device Weight (g) |
1.31910 |
Internal RAM (kByte) |
1 |
Material Type |
Tested Packaged Device |
Moisture Sensitivity Level (MSL) |
3 |
Export Control Classification Number (US) |
EAR99 |
Maximum Height Above Board (mm) |
1.600 |
Tape & Reel |
No |
UL94 (plastics flammability test) |
V0: burning stops within 10 seconds on a vertical specimen; no drips allowed |
Part Number |
MC68HC16Z1CAG16 |
Additional Features |
External Memory Controller |
Mounting Style |
Surface Mount |
Preferred Order Quantity (POQ) |
600 |
Serial Interface - Number of Interfaces |
2 / 1 |
Package Description and Mechanical Drawing |
LQFP 144 20*20*1.4P0.5 |
RoHS Certificate of Analysis (CoA) |
Contact Us |
2nd Level Interconnect |
e3 |
Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
Maximum Time at Peak Temperature (s) |
40 |
Package Length (nominal) (mm) |
20.000 |
Package Width (nominal) (mm) |
20.000 |
A/D Converter - Bits (bit) |
10 |
Device Sample Availability |
17 Mar 2004 |
Number of Reflow Cycles |
3 |
A/D Converter - Channels |
8 |
Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
Package Thickness (nominal) (mm) |
1.600 |
Description |
16 BIT MCU, 1K RAM |
Bus Frequency (Max) (MHz) |
16 |
Floor Life |
168 HOURS |
Life Cycle Description (code) |
NOT RECOMMENDED(DECLINING) |
Minimum Package Quantity (MPQ) |
60 |
Timers - Channels |
8 |
REACH SVHC |
Freescale REACH Statement |
Halogen Free |
Yes |
Peak Package Body Temperature (PPT)(°C) |
260 |
Sample Exception Availability |
N |
Ambient Operating Temperature (Min-Max) (°C) |
-40 to 85 |
MPQ Container |
TRAY |
Serial Interface - Type |
SCI / SPI |
Status |
Not Recommended for New Design |
Device Production Availability |
17 Mar 2004 |
Device Type |
MCU |
Pin/Lead/Ball Count |
144 |
Micron Size (μm) |
.55 |
Timers - Size (bit) |
8 |