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C1005C0G1H2R2C

厂商:
TDK
类别:
陶瓷电容
包装:
Cut Tape (CT)
封装:
0402 (1005 Metric)
无铅情况/ROHS:
无铅
描述:
CAP CER 2.2PF 50V C0G 0402

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  • 参数
  • 描述
参数 数值
安装类型 Surface Mount, MLCC
工作温度 -55°C ~ 125°C
容差 ±0.25pF
温度系数 C0G, NP0
应用 General Purpose
厚度 0.50mm
额定电压 50V
系列 C
尺寸 0.040" L x 0.020" W (1.00mm x 0.50mm)
特点 Low ESR
电容容量 2.2pF

The MPC8309 PowerQUICC II Pro is a member of the MPC830x family of cost-effective network communication processors that meet the requirements of multi-protocol control applications. It provides better CPU performance, additional functionality and faster interfaces than current PowerQUICC II processors while addressing important time to market, price, power consumption and board real estate requirements.


Features

  • e300 core running upto 400 MHz, DDR2 @ 266 MHz
  • QUICC Engine running up to 200 MHz
  • 2 x HDLC/TDM
  • 3 x 10/100 or 2 x 10/100 w/IEEE1588v2
  • USB 2.0
  • eSDHC (boot from eSDHC support)
  • 4 x CAN
  • 4 x UART
  • 32-bit PCI Interface
  • Local bus (boot from NOR/NAND flash memory support)
  • 1.03W typical at 333 MHz e300 core/200 MHz QUICC Engine (maximum = 1.37W)
  • 489-pin, 19 mm x 19 mm MAPBGA package
  • This product is included in Freescale’s , with assured supply for a minimum of 10 years.
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    • Branch Access Gateway
    • Low-End Base Station I/O Cards
    • Low-End Gateways
    • Base Station and Other Infrastructure Equipments
    • Test and Measurement
    • Controllers for DSLAM and Other Infrastructure Equipment

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