FAB REQUALIFICATION
Local Interconnect Network (LIN) is a serial communication protocol designed to support automotive networks in conjunction with Controller Area Network (CAN). As the lowest level of a hierarchical network, LIN enables cost-effective communication with sensors and actuators when all the features of CAN are not required.
The 33661 is a Physical Layer component dedicated to automotive LIN sub-bus applications. It offers slew rate selection for optimized operation at 10 kbps and 20 kbps, fast baud rate (above 100 kbps) for test and programming modes, excellent radiated emission performance, and safe behavior in the event of LIN bus short-to-ground or LIN bus leakage during low-power mode.
The 33661 is compatible with LIN Protocol Specification 2.0.
This product is undergoing a fab migration and device qualification is not complete. PC samples are available now. For more information contact your local sales office.
Features
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Operational from VSUP 6.0 V to 18 V DC, functional up to 27 V DC, and handles 40 V during load dump
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Active bus waveshaping offering excellent radiated emission performance
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5.0 kV ESD on LIN bus pin
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30 kΩ internal pull-up resistor
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LIN bus short-to-ground or high leakage in Sleep mode
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-18 V to +40 V DC voltage at LIN pin
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8.0 μA in Sleep mode
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Local and remote wake-up capability reported by INH and RXD pins
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5.0 V and 3.3 V compatible digital inputs without any external components required
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