The multi-chip LIN System-in-Package (SiP) is designed for LIN-bus node applications, supporting highly integrated solutions for in-vehicle LIN networks. The first LIN-system-basis-chip (LIN-SBC), ATA6624, has an integrated LIN transceiver, 5V to 7V regulator and window watchdog. The second chip contains the Atmel AVRATmega168 automative microcontroller with advanced RISC architecture and 8 Kbytes flash.All pins of the LIN-SBC and the microcontroller are bonded out to provide customers the same flexibility for their applications as they have when using discrete parts.