| RAM容量 |
2K x 8 |
| 程序存储器类型 |
FLASH |
| 工作温度 |
-40°C ~ 85°C |
| 核心处理器 |
HC08 |
| 振荡器型 |
Internal |
| 周边设备 |
LED, LVD, POR, PWM |
| 数据转换器 |
A/D 8x10b |
| 程序存储器容量 |
32KB (32K x 8) |
| 2nd Level Interconnect |
e3 |
| Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
| Export Control Classification Number (US) |
EAR99 |
| Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
| Life Cycle Description (code) |
NOT RECOMMENDED(DECLINING) |
| Material Composition Declaration (MCD) |
Download MCD Report |
| Material Type |
Tested Packaged Device |
| Micron Size (μm) |
.25 |
| Mounting Style |
Surface Mount |
| Package Material |
Plastic |
| Pin/Lead/Ball Count |
44 |
| RoHS Certificate of Analysis (CoA) |
Download RoHS CoA Report |
| Sample Exception Availability |
N |
| Floor Life |
168 HOURS |
| Maximum Time at Peak Temperature (s) |
40 |
| Minimum Package Quantity (MPQ) |
750 |
| Moisture Sensitivity Level (MSL) |
3 |
| MPQ Container |
REEL |
| POQ Container |
BOX |
| Leadtime (weeks) |
6 |
| Halogen Free |
Yes |
| Number of Reflow Cycles |
3 |
| REACH SVHC |
Freescale REACH Statement |
| 芯体尺寸 |
8-Bit |
| 系列 |
HC08 |
| 速度 |
8MHz |
| 输入/输出数 |
32 |
| 连通性 |
I²C, IRSCI, SCI, SPI |
| 工作电压 |
4.5 V ~ 5.5 V |
| Peak Package Body Temperature (PPT)(°C) |
260 |
| Package Description and Mechanical Drawing |
QFP44 10*10*2.0P0.8 |
| Package Thickness (nominal) (mm) |
2.450 |
| Device Weight (g) |
.49860 |
| Status |
Not Recommended for New Design |
| Preferred Order Quantity (POQ) |
750 |
| Description |
MCU, 32K FLASH, HS OSC |
| UL94 (plastics flammability test) |
V0: burning stops within 10 seconds on a vertical specimen; no drips allowed |
| Package Length (nominal) (mm) |
10.000 |
| Package Width (nominal) (mm) |
10.000 |
| Tape & Reel |
Yes |
| Part Number |
MC908AP32ACFBER |
| Budgetary Price($US) |
10000 @ $3.33 each |
| Device Sample Availability |
23 Sep 2005 |
| Device Production Availability |
23 Sep 2005 |