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  • S602

    厂商:

    类别:射频SiP模块

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MPXHZ6250AC6T1

厂商:
Freescale
类别:
压力传感器
包装:
-
封装:
SNSR SSOP 08 PORTED
无铅情况/ROHS:
无铅
描述:
SSOP INTEG W/PORT/SIFEL

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  • 参数
  • 描述
  • 文档
参数 数值
系列 MPXHZ6250
压力类型 Absolute
工作压力 3 ~ 36 PSI
端口尺寸 Male, 0.13" (3.302mm) Tube
输出 0 ~ 4.9V
工作电压 4.75 V ~ 5.25 V
Termination Style PCB
工作温度 -40°C ~ 125°C
Output Type Analog
Accuracy (% Error) (Max) (%) 1.5
POQ Container BOX
Status Active
Pressure Rating (Max) (psi) 36
Tape & Reel Yes
Budgetary Price($US) 10000 @ $5.26 each
Harmonized Tariff (US) Disclaimer 8542.31.0000
REACH SVHC Freescale REACH Statement
2nd Level Interconnect e4
Material Composition Declaration (MCD) Download MCD Report Download MCD Report
Supply Voltage (Typ) (V) 5
Package Material Plastic
Package Thickness (nominal) (mm) 4.000
Export Control Classification Number (US) EAR99
Leadtime (weeks) 12
RoHS Certificate of Analysis (CoA) Download RoHS CoA Report
Micron Size (μm) 6
MPQ Container REEL
Sample Exception Availability Y
Device Weight (g) .52150
Package Length (nominal) (mm) .335
Package Width (nominal) (mm) .335
Pin/Lead/Ball Count 8
Ambient Operating Temperature (Min-Max) (°C) -40 to 125
Maximum Time at Peak Temperature (s) 30
Number of Reflow Cycles 3
Part Number MPXHZ6250AC6T1
Level of Integration Integrated
Material Type Tested Packaged Device
Peak Package Body Temperature (PPT)(°C) 250
Pressure Measurement Type Absolute
Pressure Rating (Max) (kPa) 250
Description SSOP INTEG W/PORT/SIFEL
Life Cycle Description (code) PRODUCT MATURITY/SATURATION
Mounting Style Surface Mount
Porting Axial Port
Preferred Order Quantity (POQ) 600
Pressure Range Min-max (Min-Max) (kPa) 20 to 250
Supply Voltage (Min-Max) (V) 4.75 to 5.25
Application/Qualification Tier COMMERCIAL, INDUSTRIAL
RoHS technical exemption(s) 7c-I
Minimum Package Quantity (MPQ) 300
Package Description and Mechanical Drawing SNSR SSOP 08 PORTED
Pb-Free No

MPxx6250家族 (MPXH6250A和MPXHZ6250A系列) 片内集成了双极型运放电路和薄膜电阻网络,提供高电平输出信号和温度补偿。片内集成的小型化和高可靠性使飞思卡尔传感器成为汽车系统设计人员最为经济和理想的选择。

MPxx6250系列传感器是最新型的单片式带信号调理的硅压力传感器。该传感器集先进的微机械加工技术、薄膜金属化和双极型半导体工艺于一身,可提供与被测压力成正比、精确的高电平模拟输出信号。


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