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W19B160BTT7H

厂商:
Winbond
类别:
并行FLASH
包装:
07+PB
封装:
TSOP
无铅情况/ROHS:
-
描述:
绝对原装高科德51847现货

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概要
Ultra Small size High-Q RF coil for high frequency circuit of mobile application.
用途
For high-frequency applications including mobile phones, high frequency modules (PA, VCO, Rx etc.), Bluetooth and W-LAN.
特点
Compared to our existing 0603 product, this series has a 30% smaller cubic ratio and 45% smaller effective area, making it the optimal product for fine-pitch circuits.Advanced monolithic structure is formed using a multilayering and sintering process with ceramic and conductive materials for high-frequency.Lead free, lead free soldering, and RoHS compliantQ characteristics about 40% up at 1GHz (Conparitive conventional MLG0402S series 10nH)

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