| 2nd Level Interconnect |
e3 |
| Material Composition Declaration (MCD) |
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| Maximum Time at Peak Temperature (s) |
40 |
| Package Length (nominal) (mm) |
20.000 |
| Package Width (nominal) (mm) |
20.000 |
| Device Weight (g) |
1.31910 |
| Package Thickness (nominal) (mm) |
1.600 |
| Package Material |
Plastic |
| POQ Container |
BOX |
| REACH SVHC |
Freescale REACH Statement |
| Life Cycle Description (code) |
NOT RECOMMENDED(DECLINING) |
| Minimum Package Quantity (MPQ) |
60 |
| Device Sample Availability |
16 Mar 2005 |
| Maximum Height Above Board (mm) |
1.600 |
| MPQ Container |
TRAY |
| Tape & Reel |
No |
| UL94 (plastics flammability test) |
V0: burning stops within 10 seconds on a vertical specimen; no drips allowed |
| Budgetary Price($US) |
100 @ $18.84 each |
| Mounting Style |
Surface Mount |
| Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
| Preferred Order Quantity (POQ) |
300 |
| Export Control Classification Number (US) |
3A991 |
| Package Description and Mechanical Drawing |
LQFP 144 20*20*1.4P0.5 |
| RoHS Certificate of Analysis (CoA) |
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| Sample Exception Availability |
N |
| Part Number |
MC68302AG16C |
| Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
| Moisture Sensitivity Level (MSL) |
3 |
| Leadtime (weeks) |
8 |
| Peak Package Body Temperature (PPT)(°C) |
260 |
| Description |
68K INTGR COM PROC, DMA |
| Device Production Availability |
16 Mar 2005 |
| Floor Life |
168 HOURS |
| Number of Reflow Cycles |
3 |
| Micron Size (μm) |
.65 |
| Material Type |
Tested Packaged Device |
| Status |
Not Recommended for New Design |
| Pin/Lead/Ball Count |
144 |