| 2nd Level Interconnect |
e3 |
| Chip Selects |
12 |
| Material Type |
Tested Packaged Device |
| Moisture Sensitivity Level (MSL) |
3 |
| Number of Reflow Cycles |
3 |
| Package Description and Mechanical Drawing |
QFP 160 28*28*3.3P0.65 |
| Sample Exception Availability |
N |
| Micron Size (μm) |
.55 |
| Floor Life |
168 HOURS |
| Maximum Time at Peak Temperature (s) |
30 |
| Device Weight (g) |
5.56680 |
| Bus Frequency (Max) (MHz) |
20 |
| Package Thickness (nominal) (mm) |
3.850 |
| REACH SVHC |
Freescale REACH Statement |
| RoHS Certificate of Analysis (CoA) |
Contact Us |
| Part Number |
MC68336AMAB20 |
| Additional Features |
QADC |
| Budgetary Price($US) |
- |
| Timers - Channels |
16 |
| Description |
32BIT MCU,4K+3.5K RAM |
| A/D Converter - Bits (bit) |
10 |
| I/O Operating Voltage (Max) (V) |
5 |
| Life Cycle Description (code) |
REMOVED FROM ACTIVE PORTFOLIO |
| Status |
No Longer Manufactured |
| A/D Converter - Channels |
16 |
| Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
| Export Control Classification Number (US) |
EAR99 |
| External Memory Supported |
SRAM |
| Last Order Date |
31 Jul 2008 |
| Pin/Lead/Ball Count |
160 |
| Serial Interface - Type |
SCI / QSPI |
| Material Composition Declaration (MCD) |
Download MCD Report |
| Package Material |
Plastic |
| Ambient Operating Temperature (Min-Max) (°C) |
-40 to 125 |
| Mounting Style |
Surface Mount |
| UL94 (plastics flammability test) |
V0: burning stops within 10 seconds on a vertical specimen; no drips allowed |
| Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL, AUTOMOTIVE |
| Tape & Reel |
No |
| Timer Features |
TPU |
| Last Ship Date |
01 Sep 2009 |
| Package Length (nominal) (mm) |
28.000 |
| Package Width (nominal) (mm) |
28.000 |
| Peak Package Body Temperature (PPT)(°C) |
245 |
| Device Production Availability |
31 Oct 2007 |
| Device Sample Availability |
30 Sep 2007 |
| I/O Pins |
18 |
| Internal RAM (kByte) |
7.5 |