| Leadtime (weeks) |
12 |
| Maximum Time at Peak Temperature (s) |
30 |
| Package Description and Mechanical Drawing |
PLCC 68 |
| Device Production Availability |
26 Mar 2004 |
| Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
| Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
| Total DMA Channels |
2 |
| Tape & Reel |
No |
| UL94 (plastics flammability test) |
V0: burning stops within 10 seconds on a vertical specimen; no drips allowed |
| Part Number |
MC68EC000EI10 |
| Life Cycle Description (code) |
NOT RECOMMENDED(DECLINING) |
| Package Material |
Plastic |
| I/O Pins |
22 |
| REACH SVHC |
Freescale REACH Statement |
| RoHS Certificate of Analysis (CoA) |
Contact Us |
| Device Sample Availability |
26 Mar 2004 |
| I/O Operating Voltage (Max) (V) |
5 |
| MPQ Container |
RAIL |
| POQ Container |
BOX |
| Preferred Order Quantity (POQ) |
1008 |
| Status |
Not Recommended for New Design |
| Budgetary Price($US) |
10000 @ $4.47 each |
| Floor Life |
1 YEAR |
| Timer Features |
Input Capture / Output Compare / Pulse Accumulator / Periodic Interrupt Timer (PIT) |
| Additional Features |
COP |
| Device Weight (g) |
4.80195 |
| Moisture Sensitivity Level (MSL) |
2 |
| Mounting Style |
Surface Mount |
| 2nd Level Interconnect |
e3 |
| Core: Operating Frequency Max (Max) (MHz) |
20 |
| Package Length (nominal) (mm) |
24.200 |
| Description |
8/16/32 BIT MPU |
| Ambient Operating Temperature (Min-Max) (°C) |
0 to 70 |
| Peak Package Body Temperature (PPT)(°C) |
245 |
| Pin/Lead/Ball Count |
68 |
| Material Type |
Tested Packaged Device |
| Number of Reflow Cycles |
3 |
| Package Width (nominal) (mm) |
24.200 |
| Sample Exception Availability |
N |
| Minimum Package Quantity (MPQ) |
18 |
| Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
| Chip Selects |
12 |
| Export Control Classification Number (US) |
EAR99 |
| Micron Size (μm) |
.65 |
| Package Thickness (nominal) (mm) |
4.380 |
| Serial Interface - Type |
SCI / QSPI |