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NTCG163JH103HT1

厂商:
TDK
类别:
热敏电阻
包装:
Punched (Paper)Taping [180mm Reel]
封装:
-
无铅情况/ROHS:
-
描述:
-

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  • 参数
  • 描述
参数 数值
最少供货数-Nom 4000Pcs
公称零负荷电阻值的容许差 +/-3%
公称B常数的容许差 +/-3%
表面安装分类 No
重量-Nom 0.005g
包装形式 Punched (Paper)Taping [180mm Reel]
依据国际标准 JIS C 2570
使用温度范围-Min -40Cel
使用温度范围-Max 125Cel
保存温度范围-Max 125Cel
公称B常数(B25/85)-Typ 3435K
类型 Chip Type
最少包装数-Nom 4000Pcs
主体横宽(L)-Nom 1.6 mm
保存温度范围-Min -40Cel
公称B常数(B25/50)-Typ 3380K
主体纵长(W)-Nom 0.8 mm
公称零符合电阻值-Typ 10 kOhm
主体高度(T)-Nom 0.8 mm
尺寸代码 1608
适用焊接方法 Reflow

概要
A size of L1.6xW0.8xT0.8mm.It can choose from wide range resistance series.From 30ohms to 1Mohm.
用途
CELLULAR,PC,ODD,BATTERY,LCD,PRINTER,HDD,BASE STATION,POWER AMP
特点
This product include no lead and applies to the EU Council Directive 2002/95/EC RoHS.This product realized excellent solderablity and soldering heat resistance, comparing with the conventional eutectic mixture solder and lead-free solder (Sn/Ag/Cu, etc.).The 0603, 1608 and 1005 types provide 3 different shapes with identical resistance-temperature characteristics.By using layered internal electrode structure, product series provides a wide range of resistances - B constants and realized good stability of resistance value after soldering.

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