| Additional Features |
5V Tolerant / Vref / Touch Sensing Interface / Segment Display Controller / PGA / Memory Protection Unit (MPU) |
| Maximum Time at Peak Temperature (s) |
40 |
| Analog Comparator |
3 |
| Serial Interface - Number of Interfaces |
4 / 2 / 2 / 1 / 1 |
| Package Material |
Plastic |
| Preferred Order Quantity (POQ) |
480 |
| REACH SVHC |
Freescale REACH Statement |
| Status |
Active |
| Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
| Internal RAM (kByte) |
128 |
| Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
| Package Length (nominal) (mm) |
12.000 |
| Package Width (nominal) (mm) |
12.000 |
| Internal Flash (kByte) |
512 |
| Ambient Operating Temperature (Min-Max) (°C) |
-40 to 105 |
| Minimum Package Quantity (MPQ) |
1 |
| Peak Package Body Temperature (PPT)(°C) |
260 |
| Tape & Reel |
No |
| Device Type |
MCU |
| Description |
Kinetis 512K LCD |
| Life Cycle Description (code) |
PRODUCT NEWLY INTRO D/RAMP-UP |
| Total Flash memory (kByte) |
512 |
| Part Number |
PK30DN512ZVLK10 |
| Maximum Height Above Board (mm) |
1.600 |
| Device Weight (g) |
.49100 |
| Halogen Free |
Yes |
| Mounting Style |
Surface Mount |
| Sample Exception Availability |
N |
| Debug Features |
JTAG / cJTAG / Serial Wire Debug |
| Export Control Classification Number (US) |
5A992 |
| I/O Pins |
56 |
| Micron Size (μm) |
.09 |
| Floor Life |
168 HOURS |
| Moisture Sensitivity Level (MSL) |
3 |
| MPQ Container |
EACH |
| Number of Reflow Cycles |
3 |
| Serial Interface - Type |
UART / SPI / I2C / I2S / CAN |
| Core: Operating Frequency Max (Max) (MHz) |
100 |
| Max Simultaneous ADC channels |
2 DP / 31 SE |
| Supply Voltage (Min-Max) (V) |
1.71 to 3.6 |
| Timer type |
Low Power Timer / Periodic Interrupt Timer / Programmable Delay Block |
| Total DMA Channels |
16 |
| Core: Type |
ARM Cortex M4 |
| D/A Converter - Bits (bit) |
12 |
| Package Description and Mechanical Drawing |
LQFP 80 12*12*1.4P0.5 |
| POQ Container |
BOX |
| Pulse Width Modulators - Channels |
12 |
| RoHS Certificate of Analysis (CoA) |
Download RoHS CoA Report |
| 2nd Level Interconnect |
e3 |
| Budgetary Price($US) |
- |
| Independent ADC modules |
2 |
| Package Thickness (nominal) (mm) |
1.600 |
| Material Type |
Tested Packaged Device |
| Pin/Lead/Ball Count |
80 |