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MM912H634CV1AE

厂商:
Freescale
类别:
系统基础芯片
包装:
-
封装:
LQFP 48 7*7*1.4 P0.5 EP
无铅情况/ROHS:
无铅
描述:
64KS12 LIN2xLS/HS Isense

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  • 参数
  • 描述
  • 文档
参数 数值
Data Rate (Min) (kbps) 20
Device Function System Basis Chip / Embedded MCU plus Power / Comm Transceivers
Leadtime (weeks) 18
Load Supply Voltage (Max) (V) 27
Load Supply Voltage (Min) (V) 5.5
Preferred Order Quantity (POQ) 1250
Budgetary Price($US) 10000 @ $2.03 each
Device Weight (g) .20560
Export Control Classification Number (US) EAR99
Diagnostics SPI
Internal RAM (kByte) 6
Micron Size (μm) .27
Power Output Load - Current (Typ) (A) (IL) 0.05 / 0.15
Tape & Reel No
UL94 (plastics flammability test) V0: burning stops within 10 seconds on a vertical specimen; no drips allowed
POQ Container BOX
Minimum Package Quantity (MPQ) 250
RoHS Certificate of Analysis (CoA) Contact Us
Application/Qualification Tier COMMERCIAL, INDUSTRIAL, AUTOMOTIVE
Number of Reflow Cycles 3
Package Thickness (nominal) (mm) 1.400
Peak Package Body Temperature (PPT)(°C) 260
Status Active
Communication Protocol LIN
Maximum Time at Peak Temperature (s) 40
Mounting Style Surface Mount
Power Output Load - Number of Channels 2 / 2
Description 64KS12 LIN2xLS/HS Isense
Core: Type HCS12
Data Rate (Max) (kbps) 100
Sample Exception Availability Y
Part Number MM912H634CV1AE
Power Output Load - Current Limit per Output (Min) (A) (ILIM) 0.11 / 0.28
REACH SVHC Freescale REACH Statement
Life Cycle Description (code) PRODUCT RAPID GROWTH
MPQ Container TRAY
Package Length (nominal) (mm) 7.000
Package Width (nominal) (mm) 7.000
Pin/Lead/Ball Count 48
Protection Undervoltage / Overvoltage
Ambient Operating Temperature (Min-Max) (°C) -40 to 105
Moisture Sensitivity Level (MSL) 3
Package Description and Mechanical Drawing LQFP 48 7*7*1.4 P0.5 EP
Floor Life 168 HOURS
Supply Voltage (Min-Max) (V) 5.5 to 27
Power Output Load - Drain-to-Source On Resistance (Typ) (Ohm) (RDS(ON)) 7 / 2.5
Core: Operating Frequency Max (Max) (MHz) 20
Core: Operating Voltage (Spec) (V) 1.8
Harmonized Tariff (US) Disclaimer 8542.31.0000
Material Type Tested Packaged Device
2nd Level Interconnect e3
Internal Flash (kByte) 64
Material Composition Declaration (MCD) Download MCD Report Download MCD Report

The MM912G634 (48 kB) and MM912H634 (64 kB) are integrated single package solutions that integrates an HCS12 microcontroller with a SMARTMOS analog control IC. The Die to Die Interface (D2D) controlled analog die combines system base chip and application specific functions, including a LIN transceiver.


Features


CPU Core
  • 16-Bit S12 CPU, 64/48/32 kByte Program Flash
  • 4/2/0 kByte Data Flash
  • 6/2/2 kBytes of RAM
  • Background debug (BDM) & debug module (DBG)
  • 16-Bit, 4 Channel - Timer Module (TIM16B4C)
  • Die to Die bus interface for transparent memory mapping

Standard I/O
  • 6 or 10 digital MCU GPIOs shared with SPI
  • 10-Bit, 15 Channel - Analog to Digital Converter (ADC)
  • 8-Bit, 2 Channel - Pulse width modulation module (PWM)

Application Specific Functions
  • On-chip oscillator & two independent watchdogs
  • LIN 2.1 Physical Layer Interface with integrated SCI
  • Six high voltage / Wake-up inputs (L5…0)
  • Three low voltage GPIOs (PB2…0)
  • Low power modes with cyclic sense & forced wake-up
  • Two protected low side outputs to drive inductive loads
  • Two protected high side outputs
  • Hall sensor supply & integrated voltage regulator(s)
  • Reverse battery protected voltage sense module
  • Chip temperature sensor
  • Current sense module with selectable gain

Product Longevity
  • The MM912F634 is included in Freescale’s product longevity program, with assured supply for a minimum of 15 years after launch

框图

请选择文档类型:
Data Sheets
文档名称 文档类型 软件 描述
MM912H634CV1AEPDF下载 点击下载 点击下载 MM912_634D1
MM912H634CV1AEPDF下载 点击下载 点击下载 MM912F634
Fact Sheets
文档名称 文档类型 软件 描述
MM912H634CV1AEPDF下载 点击下载 点击下载 MM912_634FS1
Application Notes
文档名称 文档类型 软件 描述
MM912H634CV1AEPDF下载 点击下载 点击下载 AN4388
MM912H634CV1AEPDF下载 点击下载 点击下载 AN4427
Errata
文档名称 文档类型 软件 描述
MM912H634CV1AEPDF下载 点击下载 点击下载 MM912_634ER
MM912H634CV1AEPDF下载 点击下载 点击下载 MM912F634ER