| Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
| Export Control Classification Number (US) |
3A991 |
| Life Cycle Description (code) |
NOT RECOMMENDED(DECLINING) |
| Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
| Micron Size (μm) |
.57 |
| Mounting Style |
Surface Mount |
| Package Material |
Plastic |
| RoHS Certificate of Analysis (CoA) |
Contact Us |
| Sample Exception Availability |
N |
| Pin/Lead/Ball Count |
357 |
| I/O Operating Voltage (Max) (V) |
5 |
| Floor Life |
168 HOURS |
| Maximum Time at Peak Temperature (s) |
40 |
| Moisture Sensitivity Level (MSL) |
3 |
| Minimum Package Quantity (MPQ) |
2 |
| MPQ Container |
EACH |
| POQ Container |
EACH |
| Bus Frequency (Max) (MHz) |
33 |
| Debug Features |
JTAG |
| Internal RAM (kByte) |
2.5 |
| Halogen Free |
Yes |
| Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
| Material Type |
Tested Packaged Device |
| Number of Reflow Cycles |
3 |
| REACH SVHC |
Freescale REACH Statement |
| Serial Interface - Number of Interfaces |
4 / 2 / 1 |
| Package Length (nominal) (mm) |
25.000 |
| Package Width (nominal) (mm) |
25.000 |
| Tape & Reel |
No |
| UL94 (plastics flammability test) |
V0: burning stops within 10 seconds on a vertical specimen; no drips allowed |
| Budgetary Price($US) |
- |
| Description |
QUICC, 2SMC, 1SPI |
| Part Number |
KMC68MH360ZQ33L |
| Peak Package Body Temperature (PPT)(°C) |
260 |
| Communication Protocol |
X.21 / V.14 / UART / Transparent / SS7 / Profibus / HDLC / Ethernet / DDCMP / BISYNC / AppleTalk |
| Device Weight (g) |
2.17370 |
| Package Thickness (nominal) (mm) |
2.310 |
| Preferred Order Quantity (POQ) |
2 |
| Package Description and Mechanical Drawing |
PBGA 357 25*25*1.2P1.27 |
| Serial Interface - Type |
SCC / SMC / SPI |
| Status |
Not Recommended for New Design |
| Pb-Free |
No |
| RoHS Compliant |
No |
| Device Sample Availability |
09 Jun 2005 |
| Device Production Availability |
09 Jun 2005 |