| Description |
INTEGRATED EC000 MPU |
| Debug Features |
JTAG |
| Export Control Classification Number (US) |
EAR99 |
| POQ Container |
BOX |
| Tape & Reel |
No |
| Life Cycle Description (code) |
NOT RECOMMENDED(DECLINING) |
| Maximum Height Above Board (mm) |
1.600 |
| Mounting Style |
Surface Mount |
| Package Length (nominal) (mm) |
20.000 |
| Package Width (nominal) (mm) |
20.000 |
| Preferred Order Quantity (POQ) |
600 |
| UL94 (plastics flammability test) |
V0: burning stops within 10 seconds on a vertical specimen; no drips allowed |
| Leadtime (weeks) |
6 |
| Package Material |
Plastic |
| RoHS Certificate of Analysis (CoA) |
Contact Us |
| I/O Operating Voltage (Max) (V) |
5 |
| MPQ Container |
TRAY |
| Minimum Package Quantity (MPQ) |
60 |
| Timers - Channels |
2 |
| Budgetary Price($US) |
10000 @ $10.45 each |
| Device Weight (g) |
1.31910 |
| Moisture Sensitivity Level (MSL) |
3 |
| Number of Reflow Cycles |
3 |
| Chip Selects |
8 |
| Device Sample Availability |
15 Jan 2004 |
| Halogen Free |
Yes |
| Peak Package Body Temperature (PPT)(°C) |
260 |
| Serial Interface - Type |
UART |
| Bus Frequency (Max) (MHz) |
16 |
| Floor Life |
168 HOURS |
| Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
| Device Production Availability |
15 Jan 2004 |
| External Memory Supported |
DRAM |
| Maximum Time at Peak Temperature (s) |
40 |
| Package Description and Mechanical Drawing |
LQFP 144 20*20*1.4P0.5 |
| Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
| Micron Size (μm) |
.65 |
| Sample Exception Availability |
N |
| Part Number |
MC68306AG16B |
| Ambient Operating Temperature (Min-Max) (°C) |
0 to 70 |
| REACH SVHC |
Freescale REACH Statement |
| Status |
Not Recommended for New Design |
| 2nd Level Interconnect |
e3 |
| Package Thickness (nominal) (mm) |
1.600 |
| Pin/Lead/Ball Count |
144 |
| Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
| I/O Pins |
16 |
| Material Type |
Tested Packaged Device |