| Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
| Export Control Classification Number (US) |
EAR99 |
| Material Composition Declaration (MCD) |
Download MCD Report |
| Maximum Time at Peak Temperature (s) |
30 |
| Micron Size (μm) |
.16 |
| Pin/Lead/Ball Count |
256 |
| RoHS Certificate of Analysis (CoA) |
Contact Us |
| Sample Exception Availability |
N |
| Tape & Reel |
No |
| 程序存储器类型 |
ROMless |
| 工作温度 |
0°C ~ 70°C |
| 核心处理器 |
ARM9 |
| 周边设备 |
DMA, I²S, LCD, POR, PWM, WDT |
| Last Order Date |
30 Jun 2006 |
| Last Ship Date |
31 Dec 2006 |
| 32-bit Product Family |
i.MX |
| Floor Life |
168 HOURS |
| Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
| Material Type |
Tested Packaged Device |
| Moisture Sensitivity Level (MSL) |
3 |
| Mounting Style |
Surface Mount |
| Number of Reflow Cycles |
3 |
| Package Material |
Plastic |
| REACH SVHC |
Freescale REACH Statement |
| 芯体尺寸 |
32-Bit |
| 振荡器型 |
External |
| 系列 |
i.MX1 |
| 速度 |
200MHz |
| 输入/输出数 |
110 |
| 连通性 |
EBI/EMI, I²C, MMC, SmartCard, SPI, SSI, UART/USART, USB |
| 工作电压 |
1.7 V ~ 1.9 V |
| Budgetary Price($US) |
- |
| Life Cycle Description (code) |
REMOVED FROM ACTIVE PORTFOLIO |
| Package Thickness (nominal) (mm) |
1.600 |
| Peak Package Body Temperature (PPT)(°C) |
240 |
| RoHS Compliant |
No |
| Description |
DRAGONBALL MX1 |
| Pb-Free |
No |
| UL94 (plastics flammability test) |
V0: burning stops within 10 seconds on a vertical specimen; no drips allowed |
| Part Number |
MC9328MX1VH20 |
| Device Sample Availability |
11 Jan 2003 |
| Device Production Availability |
11 Jan 2003 |
| Package Description and Mechanical Drawing |
MAPBGA 256 14*14*0.8P0.8 |
| Package Length (nominal) (mm) |
14.000 |
| Package Width (nominal) (mm) |
14.000 |
| Device Weight (g) |
.50480 |
| Status |
Migration Complete. No Longer Manufactured. View PCN and Replacement Part |