| 电压 |
1.8V |
| Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
| Export Control Classification Number (US) |
3A991 |
| Floor Life |
168 HOURS |
| Life Cycle Description (code) |
PRODUCT STABLE GROWTH/MATURITY |
| Maximum Height Above Board (mm) |
2.520 |
| Maximum Time at Peak Temperature (s) |
30 |
| Micron Size (μm) |
.16 |
| Minimum Package Quantity (MPQ) |
44 |
| Moisture Sensitivity Level (MSL) |
3 |
| MPQ Container |
TRAY |
| Pin/Lead/Ball Count |
357 |
| POQ Container |
BOX |
| Sample Exception Availability |
Y |
| Tape & Reel |
No |
| Leadtime (weeks) |
8 |
| 32-bit Product Family |
Power Architecture |
| Ambient Operating Temperature (Min-Max) (°C) |
-40 to 100 |
| Bus Frequency (Max) (MHz) |
66 |
| Cache (kByte) |
8 |
| Co Processor Frequency (Max) (MHz) |
66 |
| Co Processor Type |
CPM |
| Core: Number of cores (Spec) |
1 |
| Core: Operating Frequency Max (Max) (MHz) |
66 |
| Core: Operating Voltage (Spec) (V) |
1.8 |
| Core: Performance in MIPS |
87 |
| Ethernet |
100 BaseT / 10 BaseT |
| External Bus Interface |
PCMCIA |
| External Memory Supported |
EDO / EPROM / FLASH / SDRAM / SRAM |
| Halogen Free |
Yes |
| Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
| I/O Operating Voltage (Max) (V) |
3.3 |
| Internal RAM (kByte) |
8 |
| Junction Operating Temperature (Max) (°C) |
100 |
| Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
| Material Type |
Tested Packaged Device |
| Mounting Style |
Surface Mount |
| Number of Reflow Cycles |
3 |
| Package Material |
Plastic |
| Power Dissipation (Max) (W) |
0.18 |
| Power Dissipation (Typ) (W) |
0.15 |
| REACH SVHC |
Freescale REACH Statement |
| RoHS Certificate of Analysis (CoA) |
Contact Us |
| Timers - Channels |
4 |
| Total DMA Channels |
8 |
| 安装类型 |
Surface Mount |
| 处理器类型 |
MPC8xx PowerQUICC 32-Bit |
| Part Number |
MPC859DSLCZP66A |
| Package Length (nominal) (mm) |
25.000 |
| Package Width (nominal) (mm) |
25.000 |
| Status |
Active |
| Budgetary Price($US) |
100 @ $19.59 each |
| RoHS Compliant |
No |
| Pb-Free |
No |
| Preferred Order Quantity (POQ) |
440 |
| Peak Package Body Temperature (PPT)(°C) |
220 |
| UL94 (plastics flammability test) |
V0: burning stops within 10 seconds on a vertical specimen; no drips allowed |
| Description |
POWER QUICC I HIP6W |
| Package Description and Mechanical Drawing |
PBGA-FW 357 25SQ1.2P1.27 |
| Device Weight (g) |
2.26750 |
| Package Thickness (nominal) (mm) |
2.310 |
| 速度 |
66MHz |
| Device Production Availability |
25 Oct 2003 |
| Device Production Availability |
16 Mar 2005 |
| Communication Protocol |
Ethernet / UART / Transparent / TDM / PIP / PCMCIA / HDLC / GCI |
| Device Sample Availability |
25 Oct 2003 |
| Device Sample Availability |
16 Mar 2005 |
| Serial Interface - Type |
SPI / I2C / Ethernet |
| I/O Pins |
59 |