| 速度 |
66MHz |
| 处理器类型 |
MPC8xx PowerQUICC 32-Bit |
| 电压 |
3.3V |
| 安装类型 |
Surface Mount |
| Ambient Operating Temperature (Min-Max) (°C) |
0 to 95 |
| Life Cycle Description (code) |
PRODUCT MATURITY/SATURATION |
| Package Length (nominal) (mm) |
25.000 |
| Package Material |
Plastic |
| Package Width (nominal) (mm) |
25.000 |
| Sample Exception Availability |
Y |
| Description |
POWER QUICC - NO LEAD |
| Leadtime (weeks) |
8 |
| Mounting Style |
Surface Mount |
| POQ Container |
BOX |
| Device Sample Availability |
11 Oct 2004 |
| External Bus Interface |
PCMCIA |
| Junction Operating Temperature (Max) (°C) |
95 |
| Preferred Order Quantity (POQ) |
440 |
| REACH SVHC |
Freescale REACH Statement |
| Core: Type |
MPC8xx |
| Junction Operating Temperature (Min) (°C) |
0 |
| Device Type |
MPU |
| RoHS Certificate of Analysis (CoA) |
Contact Us |
| Serial Interface - Type |
SPI / I2C / MII / Ethernet |
| Device Production Availability |
11 Oct 2004 |
| Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
| Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
| Minimum Package Quantity (MPQ) |
44 |
| Communication Protocol |
Ethernet |
| Export Control Classification Number (US) |
5A991 |
| Status |
Active |
| MPQ Container |
TRAY |
| Budgetary Price($US) |
100 @ $39.65 each |
| Device Weight (g) |
2.09650 |
| Micron Size (μm) |
.32 |
| Package Description and Mechanical Drawing |
PBGA 357 25*25*1.2P1.27 |
| Peak Package Body Temperature (PPT)(°C) |
245 |
| Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
| Co Processor Type |
CPM |
| Floor Life |
168 HOURS |
| Material Type |
Tested Packaged Device |
| Maximum Time at Peak Temperature (s) |
30 |
| Number of Reflow Cycles |
3 |
| Core: Operating Frequency Max (Max) (MHz) |
66 |
| Tape & Reel |
No |
| UL94 (plastics flammability test) |
V0: burning stops within 10 seconds on a vertical specimen; no drips allowed |
| Core: Number of cores (Spec) |
1 |
| Moisture Sensitivity Level (MSL) |
3 |
| Part Number |
MPC860DEVR66D4 |
| 2nd Level Interconnect |
e1 |
| External Memory Supported |
SRAM / SDRAM / FLASH / EPROM / EDO |
| Package Thickness (nominal) (mm) |
2.310 |
| Cache (kByte) |
4 |
| Pin/Lead/Ball Count |
357 |