产品分类 > 处理器 > PowerQUICC > MPC862TVR80B

可能感兴趣的商品

最近浏览过的商品

pic

MPC862TVR80B

厂商:
Freescale
类别:
PowerQUICC
包装:
Tray
封装:
PBGA 357 25*25*1.2P1.27
无铅情况/ROHS:
无铅
描述:
POWER QUICC - NO PB

我要询价我要收藏

  • 参数
  • 描述
  • 文档
参数 数值
速度 80MHz
处理器类型 MPC8xx PowerQUICC 32-Bit
电压 3.3V
安装类型 Surface Mount
Description POWER QUICC - NO PB
External Bus Interface PCMCIA
Junction Operating Temperature (Min) (°C) 0
Core: Type MPC8xx
Halogen Free Yes
Mounting Style Surface Mount
Life Cycle Description (code) PRODUCT MATURITY/SATURATION
Sample Exception Availability Y
Ambient Operating Temperature (Min-Max) (°C) 0 to 105
Leadtime (weeks) 8
POQ Container BOX
Preferred Order Quantity (POQ) 220
Package Length (nominal) (mm) 25.000
Package Material Plastic
Package Width (nominal) (mm) 25.000
REACH SVHC Freescale REACH Statement
Junction Operating Temperature (Max) (°C) 105
Micron Size (μm) .32
Peak Package Body Temperature (PPT)(°C) 245
Device Weight (g) 2.09650
MPQ Container TRAY
Tape & Reel No
UL94 (plastics flammability test) V0: burning stops within 10 seconds on a vertical specimen; no drips allowed
Part Number MPC862TVR80B
Core: Operating Frequency Typ (Typ) (MHz) 80
Ethernet Fast Ethernet
Export Control Classification Number (US) 5A991
Communication Protocol UTOPIA / Transparent / TDM / PIP / IrDA / Ethernet / BISYNC / AppleTalk / ATM / AAL
Harmonized Tariff (US) Disclaimer 8542.31.0000
Material Composition Declaration (MCD) Download MCD Report Download MCD Report
Minimum Package Quantity (MPQ) 44
Serial Interface - Type SCC / SMC / SPI / I2C
Device Sample Availability 20 Nov 2004
Device Type MPU
RoHS Certificate of Analysis (CoA) Contact Us
Application/Qualification Tier COMMERCIAL, INDUSTRIAL
Device Production Availability 20 Nov 2004
Floor Life 168 HOURS
Material Type Tested Packaged Device
Maximum Time at Peak Temperature (s) 30
Number of Reflow Cycles 3
32-bit Product Family Power Architecture
Core: Number of cores (Spec) 1
Status Active
Serial Interface - Number of Interfaces 4 / 2 / 1 / 1
Budgetary Price($US) 100 @ $63.11 each
Cache (kByte) 4
External Memory Supported DRAM / EDO / EPROM / SDRAM / SRAM
Pin/Lead/Ball Count 357
2nd Level Interconnect e1
Package Thickness (nominal) (mm) 2.310
Moisture Sensitivity Level (MSL) 3
Package Description and Mechanical Drawing PBGA 357 25*25*1.2P1.27
原装原标原包
Fact Sheets
文档名称 文档类型 软件 描述
Packaging Information
文档名称 文档类型 软件 描述
Reference Manuals
文档名称 文档类型 软件 描述
Application Notes
文档名称 文档类型 软件 描述
Selector Guides
文档名称 文档类型 软件 描述
Engineering Bulletins
文档名称 文档类型 软件 描述
Product Change Notices
文档名称 文档类型 软件 描述
Data Sheets
文档名称 文档类型 软件 描述
Errata
文档名称 文档类型 软件 描述
Product Briefs
文档名称 文档类型 软件 描述