| 速度 |
66MHz |
| 处理器类型 |
MPC8xx PowerQUICC 32-Bit |
| 电压 |
3.3V |
| 安装类型 |
Surface Mount |
| Budgetary Price($US) |
100 @ $15.66 each |
| Device Production Availability |
23 Apr 2005 |
| Mounting Style |
Surface Mount |
| Ambient Operating Temperature (Min-Max) (°C) |
0 to 95 |
| Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
| Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
| Moisture Sensitivity Level (MSL) |
3 |
| Package Width (nominal) (mm) |
23.000 |
| Serial Interface - Type |
SCC / SMC / I2C |
| Description |
PQ I HIP6W DUET |
| Part Number |
MPC875VR66 |
| Status |
Active |
| Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
| MPQ Container |
TRAY |
| Cache (kByte) |
8 |
| Export Control Classification Number (US) |
5A002 |
| Core: Type |
MPC8xx |
| Package Length (nominal) (mm) |
23.000 |
| REACH SVHC |
Freescale REACH Statement |
| Device Weight (g) |
1.66295 |
| Ethernet |
Fast Ethernet |
| Junction Operating Temperature (Min) (°C) |
0 |
| Pin/Lead/Ball Count |
256 |
| Preferred Order Quantity (POQ) |
300 |
| Tape & Reel |
No |
| UL94 (plastics flammability test) |
V0: burning stops within 10 seconds on a vertical specimen; no drips allowed |
| 32-bit Product Family |
Power Architecture |
| Junction Operating Temperature (Max) (°C) |
95 |
| Minimum Package Quantity (MPQ) |
60 |
| 2nd Level Interconnect |
e1 |
| Serial Interface - Number of Interfaces |
1 / 1 / 1 |
| Core: Number of cores (Spec) |
1 |
| Peak Package Body Temperature (PPT)(°C) |
245 |
| Device Type |
MPU |
| External Bus Interface |
PCMCIA |
| Floor Life |
168 HOURS |
| Leadtime (weeks) |
12 |
| Life Cycle Description (code) |
PRODUCT STABLE GROWTH/MATURITY |
| Maximum Time at Peak Temperature (s) |
30 |
| Number of Reflow Cycles |
3 |
| RoHS Certificate of Analysis (CoA) |
Contact Us |
| Core: Operating Frequency Typ (Typ) (MHz) |
66 |
| Package Material |
Plastic |
| POQ Container |
BOX |
| Package Thickness (nominal) (mm) |
2.540 |
| Sample Exception Availability |
Y |
| USB |
USB 2.0 |
| Communication Protocol |
Transparent / IrDA / HDLC / Ethernet / BISYNC / AppleTalk |
| External Memory Supported |
SRAM / SDRAM / EPROM / EDO / DRAM |
| Device Sample Availability |
23 Apr 2005 |
| Material Type |
Tested Packaged Device |
| Micron Size (μm) |
.16 |
| Package Description and Mechanical Drawing |
PBGA 256 23*23*1.22P1.27 |