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KMPC8270CZQMIBA

厂商:
Freescale
类别:
PowerQUICC II
包装:
Tray
封装:
FPBGA 516 27*27*1.25P1.0
无铅情况/ROHS:
有铅
描述:
POWER QUICC II HIP7A ZQ

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  • 参数
  • 描述
  • 文档
参数 数值
速度 266MHz
处理器类型 MPC82xx PowerQUICC II 32-bit
电压 1.5V
安装类型 Surface Mount
Leadtime (weeks) 8
Mounting Style Surface Mount
POQ Container BOX
Sample Exception Availability N
Budgetary Price($US) -
Device Production Availability 18 Jun 2004
Ethernet 100 BaseT
Life Cycle Description (code) NOT RECOMMENDED(DECLINING)
Part Number KMPC8270CZQMIBA
Cache (kByte) 32
Capture Symbol PDF
Package Width (nominal) (mm) 27.000
Core: Type 603e
Serial Interface - Type I2C / MII / SPI / USB / Ethernet
Description POWER QUICC II HIP7A ZQ
Core: Operating Voltage (Spec) (V) 1.5
Core: Performance in MIPS 505.4
Export Control Classification Number (US) 5A991
I/O Operating Voltage (Max) (V) 3.3
Maximum Height Above Board (mm) 2.550
Package Thickness (nominal) (mm) 2.250
Power Dissipation (Typ) (W) 1.05
RoHS Compliant No
Device Weight (g) 4.63415
Harmonized Tariff (US) Disclaimer 8542.31.0000
I/O Pins 120
Material Composition Declaration (MCD) Download MCD Report Download MCD Report
32-bit Product Family Power Architecture
Core: Number of cores (Spec) 1
Device Sample Availability 18 Jun 2004
Internal RAM (kByte) 64
Minimum Package Quantity (MPQ) 1
Pb-Free No
Preferred Order Quantity (POQ) 200
Device Sample Availability 18 Jun 2004
Power Dissipation (Max) (W) 1.1
Total DMA Channels 30
Application/Qualification Tier COMMERCIAL, INDUSTRIAL
Co Processor Type CPM
Communication Protocol UART / Transparent / SS7 / HDLC / GCI / Ethernet / BISYNC / AppleTalk / TDM / UTOPIA
Material Type Tested Packaged Device
Maximum Time at Peak Temperature (s) 30
Moisture Sensitivity Level (MSL) 3
Number of Reflow Cycles 3
USB USB 2.0
Micron Size (μm) .13
Package Description and Mechanical Drawing FPBGA 516 27*27*1.25P1.0
Pin/Lead/Ball Count 516
Device Type MPU
External Bus Interface 60x / Local / PCI
Halogen Free Yes
RoHS Certificate of Analysis (CoA) Contact Us
Core: Operating Frequency Max (Max) (MHz) 266
External Memory Supported EPROM / FLASH / SDRAM / SRAM / DRAM
MPQ Container TRAY
REACH SVHC Freescale REACH Statement
Tape & Reel No
UL94 (plastics flammability test) V0: burning stops within 10 seconds on a vertical specimen; no drips allowed
Device Production Availability 18 Jun 2004
Junction Operating Temperature (Max) (°C) 105
Peak Package Body Temperature (PPT)(°C) 245
Bus Frequency (Max) (MHz) 66
Co Processor Frequency (Max) (MHz) 200
Floor Life 168 HOURS
Status Not Recommended for New Design
Ambient Operating Temperature (Min-Max) (°C) -40 to 105
Footprint (land pattern) PDF
Package Length (nominal) (mm) 27.000
Package Material Plastic

Introducing the next generation of PowerQUICC II™ processors: the MPC8270, MPC8275 and MPC8280.

Utilizing Freescale's HiPerMOS7 0.13-micron process technology, the next generation PowerQUICC II family offers a range of performance, feature enhancements and package options with lower power requirements. Ideal for wired and wireless infrastructure communications processing tasks, enhancements to the PowerQUICC II family offer system designers a high degree of integrated features and functionality and a compelling, proven architecture.

The next generation of PowerQUICC II processors is an optimum solution for integrated control and forwarding plane processing in high-end communications and networking equipment -- such as routers, DSLAMs, remote access concentrators, telecom switching equipment and cellular base stations. Combining extensive layer 2 functionality with control plane processing, Freescale's PowerQUICC II processors include a high-performance embedded 603e™ core built on Power Architecture technology, and a powerful RISC-based Communications Processor Module (CPM). The CPM off-loads peripheral tasks from the embedded Power Architecture core and provides support for multiple communications protocols including 10/100Mbps Ethernet, 155Mbps ATM and 256 HDLC channels. And, of course, the next generation PowerQUICC II devices retain full software compatibility with the PowerQUICC II family.

A range of performance and package options

Taking advantage of the 0.13-micron process, the next generation of PowerQUICC II devices offers significant performance increases and power savings over the current generation PowerQUICC II devices, with speeds of up to 450MHz and 300MHz in the core and CPM respectively at less than 2 watts. The new processors continue to enhance the PowerQUICC architecture's industry-leading ATM support, offering up to 2 UTOPIA ports with support for up to 31 PHYs per interface -- ideal for high-density DSLAM line cards.

The next generation of PowerQUICC II solutions also delivers support for USB, an on-target addition for high performance SOHO and CPE networking equipment. And unlike most other integrated communications processors in the market, the PowerQUICC architecture integrates two processing cores to handle specific tasks: the core built on Power Architecture technology and the RISC-based CPM -- enabling a balanced approach for systems by handling both high-level tasks and low-level communications all in one integrated device.

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Features

  • 603e core with 16K inst and 16K data caches
  • 64-bit 60x bus, 32-bit PCI/local bus
  • 128K ROM, 32K IRAM, 32K DPRAM
  • Three FCCs for 10/100 Ethernet
  • 128 HDLC channels, 4 TDMs
  • 4 SCCs, 2 SMCs, SPI, I2C
  • Memory controller built from SDRAM, UPM, GPCM machines
  • New features -- USB, RMII
  • Performance
    • 266 MHz CPU, 200 MHz CPM, 66 MHz bus
    • ~ 1W @ full performance, 1.5V
  • Technology
    • HIP7AP .13 micron, 3.3V I/O, 1.5V Core
    • 516 PBGA, 27x27mm, 1mm ball pitch
      • ZQ package has lead-bearing spheres
      • VR package is lead-free
  • 603e core with 16K inst and 16K data caches
  • 64-bit 60x bus, 32-bit PCI bus
  • 128K ROM, 32K IRAM, 32K DPRAM
  • Three FCCs for 10/100 Ethernet
  • 128 HDLC channels, 4 TDMs
  • 4 SCCs, 2 SMCs, SPI, I2C
  • Memory controller built from SDRAM, UPM, GPCM machines
  • New features -- USB, RMII

Packaging Information
文档名称 文档类型 软件 描述
KMPC8270CZQMIBAPDF下载 点击下载 点击下载 PBGAPRES
KMPC8270CZQMIBAPDF下载 点击下载 点击下载 TBGAPRESPKG
Fact Sheets
文档名称 文档类型 软件 描述
KMPC8270CZQMIBAPDF下载 点击下载 点击下载 MPC8280FACT
Product Change Notices
文档名称 文档类型 软件 描述
KMPC8270CZQMIBAPDF下载 点击下载 点击下载 PCN12125
KMPC8270CZQMIBAPDF下载 点击下载 点击下载 PCN10367
KMPC8270CZQMIBAPDF下载 点击下载 点击下载 PCN9586
KMPC8270CZQMIBAPDF下载 点击下载 点击下载 PCN11123
Application Notes
文档名称 文档类型 软件 描述
KMPC8270CZQMIBAPDF下载 点击下载 点击下载 AN2059
KMPC8270CZQMIBAPDF下载 点击下载 点击下载 AN2349
KMPC8270CZQMIBAPDF下载 点击下载 点击下载 AN2585
KMPC8270CZQMIBAPDF下载 点击下载 点击下载 AN2754
KMPC8270CZQMIBAPDF下载 点击下载 点击下载 AN2335
KMPC8270CZQMIBAPDF下载 点击下载 点击下载 AN2922
KMPC8270CZQMIBAPDF下载 点击下载 点击下载 AN2491
KMPC8270CZQMIBAPDF下载 点击下载 点击下载 AN2587
KMPC8270CZQMIBAPDF下载 点击下载 点击下载 AN2654
KMPC8270CZQMIBAPDF下载 点击下载 点击下载 AN2291
KMPC8270CZQMIBAPDF下载 点击下载 点击下载 AN3966
KMPC8270CZQMIBAPDF下载 点击下载 点击下载 AN2347
KMPC8270CZQMIBAPDF下载 点击下载 点击下载 AN2915
KMPC8270CZQMIBAPDF下载 点击下载 点击下载 AN3352
KMPC8270CZQMIBAPDF下载 点击下载 点击下载 AN2431
Product Numbering Scheme
文档名称 文档类型 软件 描述
KMPC8270CZQMIBAPDF下载 点击下载 点击下载 MPC82XXHIP7PNS
Errata
文档名称 文档类型 软件 描述
KMPC8270CZQMIBAPDF下载 点击下载 点击下载 MPC8280CE
Product Briefs
文档名称 文档类型 软件 描述
KMPC8270CZQMIBAPDF下载 点击下载 点击下载 QUICC_CODESPB
White Papers
文档名称 文档类型 软件 描述
KMPC8270CZQMIBAPDF下载 点击下载 点击下载 MPC826XSDRAMWP
Brochures
文档名称 文档类型 软件 描述
KMPC8270CZQMIBAPDF下载 点击下载 点击下载 PWRARCHQIQSG
Data Sheets
文档名称 文档类型 软件 描述
KMPC8270CZQMIBAPDF下载 点击下载 点击下载 MPC8280EC
Reference Manuals
文档名称 文档类型 软件 描述
KMPC8270CZQMIBAPDF下载 点击下载 点击下载 MPC8260ESS7UMAD
KMPC8270CZQMIBAPDF下载 点击下载 点击下载 G2CORERM
KMPC8270CZQMIBAPDF下载 点击下载 点击下载 MPC8280RM
KMPC8270CZQMIBAPDF下载 点击下载 点击下载 MPC60XBUSRM
KMPC8270CZQMIBAPDF下载 点击下载 点击下载 MPC8280RMAD
KMPC8270CZQMIBAPDF下载 点击下载 点击下载 MPCFPE32B