速度 |
300MHz |
处理器类型 |
MPC82xx PowerQUICC II 32-bit |
电压 |
1.8V |
安装类型 |
Surface Mount |
Micron Size (μm) |
.23 |
Peak Package Body Temperature (PPT)(°C) |
220 |
Serial Interface - Type |
I2C |
I/O Operating Voltage (Max) (V) |
3.3 |
RoHS Compliant |
No |
Ambient Operating Temperature (Min-Max) (°C) |
0 to 105 |
Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
Moisture Sensitivity Level (MSL) |
3 |
Number of Reflow Cycles |
3 |
Pin/Lead/Ball Count |
352 |
Status |
Active |
Core: Performance in MIPS |
570 |
REACH SVHC |
Freescale REACH Statement |
Device Production Availability |
15 Apr 2003 |
Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
I/O Pins |
120 |
Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
Package Description and Mechanical Drawing |
TBGA 352 35*35*1.7P1.27 |
Pb-Free |
No |
Bus Frequency (Max) (MHz) |
100 |
Core: Operating Voltage (Spec) (V) |
1.8 |
Device Sample Availability |
23 Apr 2003 |
Export Control Classification Number (US) |
3A991 |
Device Production Availability |
23 Apr 2003 |
Mounting Style |
Surface Mount |
POQ Container |
BOX |
Power Dissipation (Max) (W) |
2.5 |
Description |
INTEGRATED HOST PROC |
Cache (kByte) |
32 |
Life Cycle Description (code) |
PRODUCT MATURITY/SATURATION |
Package Length (nominal) (mm) |
35.000 |
Package Thickness (nominal) (mm) |
1.700 |
Package Width (nominal) (mm) |
35.000 |
Capture Symbol |
PDF |
Maximum Height Above Board (mm) |
1.650 |
Package Material |
Plastic |
Sample Exception Availability |
Y |
32-bit Product Family |
Power Architecture |
Core: Number of cores (Spec) |
1 |
Timers - Number of Timers |
4 |
Part Number |
MPC8245LZU300D |
Footprint (land pattern) |
PDF |
Core: Operating Frequency Max (Max) (MHz) |
300 |
Device Type |
MPU |
Leadtime (weeks) |
12 |
Preferred Order Quantity (POQ) |
240 |
RoHS Certificate of Analysis (CoA) |
Contact Us |
Budgetary Price($US) |
100 @ $35.73 each |
Core: Type |
603e |
Junction Operating Temperature (Max) (°C) |
105 |
Minimum Package Quantity (MPQ) |
24 |
Device Sample Availability |
15 Apr 2003 |
External Bus Interface |
Local / 60x / PCI |
External Memory Supported |
EPROM / SDRAM |
Floor Life |
168 HOURS |
Material Type |
Tested Packaged Device |
Maximum Time at Peak Temperature (s) |
30 |
Power Dissipation (Typ) (W) |
2 |
Device Weight (g) |
9.24700 |
MPQ Container |
TRAY |
Tape & Reel |
No |