| 电压 |
1.8V |
| 32-bit Product Family |
Power Architecture |
| Ambient Operating Temperature (Min-Max) (°C) |
-40 to 105 |
| Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
| Bus Frequency (Max) (MHz) |
100 |
| Cache (kByte) |
32 |
| Capture Symbol |
PDF |
| Core: Number of cores (Spec) |
1 |
| Core: Operating Frequency Max (Max) (MHz) |
300 |
| Core: Operating Voltage (Spec) (V) |
1.8 |
| Core: Performance in MIPS |
570 |
| Core: Type |
603e |
| Device Type |
MPU |
| Export Control Classification Number (US) |
3A991 |
| External Bus Interface |
Local / 60x / PCI |
| External Memory Supported |
EPROM / SDRAM |
| Floor Life |
168 HOURS |
| Footprint (land pattern) |
PDF |
| Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
| I/O Operating Voltage (Max) (V) |
3.3 |
| Junction Operating Temperature (Max) (°C) |
105 |
| Leadtime (weeks) |
12 |
| Life Cycle Description (code) |
PRODUCT MATURITY/SATURATION |
| Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
| Material Type |
Tested Packaged Device |
| Maximum Height Above Board (mm) |
1.650 |
| Maximum Time at Peak Temperature (s) |
30 |
| Micron Size (μm) |
.23 |
| Minimum Package Quantity (MPQ) |
24 |
| Moisture Sensitivity Level (MSL) |
3 |
| Mounting Style |
Surface Mount |
| MPQ Container |
TRAY |
| Number of Reflow Cycles |
3 |
| Package Material |
Plastic |
| Pin/Lead/Ball Count |
352 |
| POQ Container |
BOX |
| Power Dissipation (Max) (W) |
2.5 |
| Power Dissipation (Typ) (W) |
2 |
| REACH SVHC |
Freescale REACH Statement |
| RoHS Certificate of Analysis (CoA) |
Contact Us |
| Sample Exception Availability |
Y |
| Tape & Reel |
No |
| Timers - Number of Timers |
4 |
| 安装类型 |
Surface Mount |
| 处理器类型 |
MPC82xx PowerQUICC II 32-bit |
| 速度 |
300MHz |
| Status |
Active |
| Part Number |
MPC8245TZU300D |
| Package Length (nominal) (mm) |
35.000 |
| Package Width (nominal) (mm) |
35.000 |
| Serial Interface - Type |
I2C |
| Preferred Order Quantity (POQ) |
240 |
| Budgetary Price($US) |
100 @ $46.45 each |
| I/O Pins |
120 |
| Description |
INTEGRATED HOST PROC |
| Device Weight (g) |
9.24700 |
| Device Sample Availability |
15 Apr 2003 |
| Device Sample Availability |
23 Apr 2003 |
| Peak Package Body Temperature (PPT)(°C) |
220 |
| Package Thickness (nominal) (mm) |
1.700 |
| Package Description and Mechanical Drawing |
TBGA 352 35*35*1.7P1.27 |
| Device Production Availability |
15 Apr 2003 |
| Device Production Availability |
23 Apr 2003 |
| Pb-Free |
No |
| RoHS Compliant |
No |