速度 |
266MHz |
处理器类型 |
MPC82xx PowerQUICC II 32-bit |
电压 |
2V |
安装类型 |
Surface Mount |
Export Control Classification Number (US) |
3A991 |
I/O Pins |
120 |
Life Cycle Description (code) |
PRODUCT STABLE GROWTH/MATURITY |
MPQ Container |
TRAY |
Tape & Reel |
No |
Device Type |
MPU |
Power Dissipation (Max) (W) |
2.9 |
RoHS Certificate of Analysis (CoA) |
Contact Us |
Part Number |
MPC8255ACVVMHBB |
Status |
Active |
Core: Type |
603e |
External Memory Supported |
SRAM / SDRAM / FLASH / EPROM / DRAM |
Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
Maximum Time at Peak Temperature (s) |
40 |
Serial Interface - Type |
Ethernet |
Total DMA Channels |
28 |
Communication Protocol |
Ethernet |
Core: Performance in MIPS |
505.4 |
Pin/Lead/Ball Count |
480 |
Capture Symbol |
PDF |
Core: Operating Voltage (Spec) (V) |
2 |
Device Weight (g) |
10.06085 |
I/O Operating Voltage (Max) (V) |
3.3 |
Internal RAM (kByte) |
32 |
Micron Size (μm) |
.23 |
Timers - Size (bit) |
16 |
Ethernet |
100 BaseT |
32-bit Product Family |
Power Architecture |
Core: Number of cores (Spec) |
1 |
Timers - Number of Timers |
4 |
Bus Frequency (Max) (MHz) |
66 |
Moisture Sensitivity Level (MSL) |
3 |
Package Length (nominal) (mm) |
37.500 |
Package Width (nominal) (mm) |
37.500 |
Description |
PQ II HIP4 NO-PB REV B |
Package Description and Mechanical Drawing |
TBGA 480 37.5SQ*1.7P1.27 |
2nd Level Interconnect |
e1 |
Co Processor Frequency (Max) (MHz) |
166 |
Device Production Availability |
01 Jun 2005 |
Leadtime (weeks) |
8 |
Mounting Style |
Surface Mount |
Preferred Order Quantity (POQ) |
105 |
Budgetary Price($US) |
100 @ $89.20 each |
Cache (kByte) |
32 |
Footprint (land pattern) |
PDF |
Package Material |
Plastic |
Package Thickness (nominal) (mm) |
1.700 |
POQ Container |
BOX |
Co Processor Type |
CPM |
Floor Life |
168 HOURS |
Number of Reflow Cycles |
3 |
Sample Exception Availability |
Y |
Ambient Operating Temperature (Min-Max) (°C) |
-40 to 105 |
Junction Operating Temperature (Max) (°C) |
105 |
Peak Package Body Temperature (PPT)(°C) |
260 |
External Bus Interface |
60x / PCI |
Material Type |
Tested Packaged Device |
Maximum Height Above Board (mm) |
1.650 |
Minimum Package Quantity (MPQ) |
21 |
Power Dissipation (Typ) (W) |
2.3 |
Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
Core: Operating Frequency Max (Max) (MHz) |
266 |
Device Sample Availability |
01 Jun 2005 |
REACH SVHC |
Freescale REACH Statement |