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KMPC8358EVVAGDGA

厂商：
Freescale
类别：
PowerQUICC II pro
包装：
Tray
封装：
TBGA740 37.5*37.5*1.69P1
无铅情况/ROHS：
无铅
描述：
836X CGM TBGA ENCRP NO-PB

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  • 参数
  • 描述
  • 文档
参数 数值
速度 400MHz
处理器类型 MPC83xx PowerQUICC II Pro 32-Bit
电压 1.2V
安装类型 Surface Mount
Harmonized Tariff (US) Disclaimer 8542.31.0000
Junction Operating Temperature (Max) (°C) 105
MPQ Container TRAY
Micron Size (μm) .13
Mounting Style Surface Mount
2nd Level Interconnect e2
Cache (kByte) 32
Device Weight (g) 10.79630
Package Material Plastic
POQ Container BOX
32-bit Product Family Power Architecture
Life Cycle Description (code) NOT RECOMMENDED(DECLINING)
Minimum Package Quantity (MPQ) 1
Serial Interface - Number of Interfaces 1 / 1 / 2 / 1 / 1
Core: Type e300
External Memory Supported DDR / DDR1 / DDR2 / DRAM / EPROM / SDRAM
Tape & Reel No
UL94 (plastics flammability test) V0: burning stops within 10 seconds on a vertical specimen; no drips allowed
USB USB 2.0
Export Control Classification Number (US) 5A002
Number of Reflow Cycles 3
Core: Operating Frequency Typ (Typ) (MHz) 400
Description 836X CGM TBGA ENCRP NO-PB
Part Number KMPC8358EVVAGDGA
Bus Frequency (Max) (MHz) 133
Core: Number of cores (Spec) 1
Budgetary Price($US) -
Communication Protocol Ethernet / ATM
Material Composition Declaration (MCD) Download MCD Report Download MCD Report
Maximum Time at Peak Temperature (s) 40
Device Type MPU
External Bus Interface Local / PCI
Floor Life 168 HOURS
Package Thickness (nominal) (mm) 1.460
RoHS Certificate of Analysis (CoA) Contact Us
Ethernet 10/100/1000 BaseT
Package Length (nominal) (mm) 37.500
Package Width (nominal) (mm) 37.500
Pin/Lead/Ball Count 740
REACH SVHC Freescale REACH Statement
Ambient Operating Temperature (Min-Max) (°C) 0 to 105
Halogen Free Yes
Peak Package Body Temperature (PPT)(°C) 260
Sample Exception Availability N
Serial Interface - Type HDLC / I2C / SPI / UART / USB
Application/Qualification Tier COMMERCIAL, INDUSTRIAL
Moisture Sensitivity Level (MSL) 3
Status Not Recommended for New Design
Junction Operating Temperature (Min) (°C) 0
Preferred Order Quantity (POQ) 210
Material Type Tested Packaged Device
Package Description and Mechanical Drawing TBGA740 37.5*37.5*1.69P1

Freescale Semiconductor's MPC8360E PowerQUICC II™ Pro family of integrated communications processors is a next-generation extension of the popular PowerQUICC II line containing cores built on Power Architecture technology. The MPC8360E family incorporates a next-generation communications engine, the QUICC™ Engine, supporting a wide range of protocols, including Gigabit Ethernet and OC-12 asynchronous transfer mode (ATM)/Packet over Sonet (POS). Additional enhancements include the e300 core (enhanced version of the 603e™ core with larger caches), scaling up to 667 MHz, a DDR memory controller and the integrated security engine.

The MPC8360E PowerQUICC II Pro communications processor's advanced features make it suitable for today's and tomorrow's wired and wireless access equipment, as well as small and medium enterprise networking equipment. Target applications include multitenant units (MTUs), digital subscriber line access multiplexers (DSLAMs), wireless basestations, multi and fixed subscriber access nodes, add/drop multiplexers and routers.

The MPC8358E processor, a member of the MPC8360E PowerQUICC II Pro family, is pin-compatible with the MPC8360E (TBGA only). The MPC8358E offers a cost-effective, low-power processing solution that meets the performance requirements for broadband access applications, such as small-to-medium enterprise (SME) routers, low-end DSLAMs and IP private automatic branch exchange (PABX) systems.

e300 System-on-a-Chip Platform
The MPC8358E PowerQUICC II Pro family is based on the e300 system-on-a-chip (SoC) platform. This makes it easy and fast to add or remove functional blocks and develop additional SoC-based family members for emerging markets. At the heart of the e300 SoC platform is Freescale's e300 core built on Power Architecture technology. The e300 core is an enhanced version of the 603e core used in previous-generation PowerQUICC II processors.

Enhancements include twice as much L1 cache (32 KB data cache and 32 KB instruction cache) with integrated parity checking and other performance-enhancing features. The e300 core is software-compatible with existing 603e core-based products.

Connectivity
The MPC8360E processor is designed to support a wide range of communications interfaces, such as MII, RMII, GMII, TBI, RTBI, NMSI, UTOPIA, POS and TDM. The DDR memory controller helps to ensure high-speed memory access and a local system bus operating up to 133 MHz. Additional system connectivity is supplied by dual UART, dual inter-integrated circuit (I2C), dual serial peripheral interface (SPI), PCI interfaces and Universal Serial Bus (USB) interface (USB 2.0 full-/low-speed compatible).

Integrated Security The MPC8360E and MPC8358E processors feature integrated security with the powerful integrated security engine derived from Freescale's security coprocessor product line. Integrated security supports DES, 3DES, MD-5, SHA-1, AES and ARC-4 encryption algorithms, as well as a public key accelerator and an on-chip random number generator. The integrated security engine is capable of single-pass encryption and authentication, as required by IPsec, the IEEE® 802.11i standard and other security protocols.

Typical Applications
DSL infrastructure
  • DSLAMs
  • MTUs
Add/drop multiplexers and digital cross connects

Multiservice access nodes (MSAN) 
Wireless infrastructure