| 速度 |
333MHz |
| 处理器类型 |
MPC83xx PowerQUICC II Pro 32-Bit |
| 电压 |
1V |
| 安装类型 |
Surface Mount |
| Budgetary Price($US) |
1000 @ $14.45 each |
| External Bus Interface |
Local / PCI |
| Preferred Order Quantity (POQ) |
200 |
| Part Number |
MPC8321VRAFDC |
| I/O Operating Voltage (Max) (V) |
1.8 / 3.3 |
| Life Cycle Description (code) |
PRODUCT RAPID GROWTH |
| Sample Exception Availability |
Y |
| Device Weight (g) |
4.37440 |
| Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
| Micron Size (μm) |
.09 |
| Package Length (nominal) (mm) |
27.000 |
| POQ Container |
BOX |
| Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
| Core: Operating Voltage (Spec) (V) |
1 |
| Material Type |
Tested Packaged Device |
| Co Processor Frequency (Max) (MHz) |
200 |
| Export Control Classification Number (US) |
5A992 |
| Floor Life |
168 HOURS |
| Halogen Free |
Yes |
| Junction Operating Temperature (Max) (°C) |
105 |
| Cache (kByte) |
32 |
| Core: Performance in MIPS |
633 |
| Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
| MPQ Container |
TRAY |
| Peak Package Body Temperature (PPT)(°C) |
260 |
| Tape & Reel |
No |
| UL94 (plastics flammability test) |
V0: burning stops within 10 seconds on a vertical specimen; no drips allowed |
| Core: Operating Frequency Max (Max) (MHz) |
333 |
| Package Material |
Plastic |
| REACH SVHC |
Freescale REACH Statement |
| RoHS Certificate of Analysis (CoA) |
Contact Us |
| USB |
USB 2.0 |
| Package Description and Mechanical Drawing |
PBGA-PGE 516 27SQ1.25P1 |
| Status |
Active |
| Co Processor Type |
QUICC |
| Ethernet |
100 BaseT |
| External Memory Supported |
SDRAM / FLASH / EPROM / DRAM / DDR2 / DDR1 |
| Leadtime (weeks) |
8 |
| Maximum Time at Peak Temperature (s) |
40 |
| Minimum Package Quantity (MPQ) |
40 |
| Core: Type |
e300 |
| Description |
8321 NOPB PBGA W/O ENCR |
| Ambient Operating Temperature (Min-Max) (°C) |
0 to 105 |
| Moisture Sensitivity Level (MSL) |
3 |
| Number of Reflow Cycles |
3 |
| Package Thickness (nominal) (mm) |
2.250 |
| Pin/Lead/Ball Count |
516 |
| Power Dissipation (Max) (W) |
2 |
| Power Dissipation (Typ) (W) |
1.8 |
| 2nd Level Interconnect |
e1 |
| Mounting Style |
Surface Mount |
| Package Width (nominal) (mm) |
27.000 |