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MPC8358EVVADDEA

厂商：
Freescale
类别：
PowerQUICC II pro
包装：
Tray
封装：
TBGA740 37.5*37.5*1.69P1
无铅情况/ROHS：
无铅
描述：
8360 TBGA ENCRP NO-PB

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  • 参数
  • 描述
  • 文档
参数 数值
速度 266MHz
处理器类型 MPC83xx PowerQUICC II Pro 32-Bit
电压 1.2V
安装类型 Surface Mount
Core: Performance in MIPS 503
Harmonized Tariff (US) Disclaimer 8542.31.0000
Junction Operating Temperature (Max) (°C) 105
Life Cycle Description (code) PRODUCT RAPID GROWTH
Budgetary Price($US) 100 @ $43.06 each
Material Composition Declaration (MCD) Download MCD Report Download MCD Report
Core: Operating Voltage (Spec) (V) 1.2
Junction Operating Temperature (Min) (°C) 0
Package Material Plastic
POQ Container BOX
Power Dissipation (Typ) (W) 2.5
Tape & Reel No
Micron Size (μm) .13
Mounting Style Surface Mount
Core: Type e300
External Memory Supported DDR / DDR1 / DDR2 / DRAM / EPROM / SDRAM
UL94 (plastics flammability test) V0: burning stops within 10 seconds on a vertical specimen; no drips allowed
Export Control Classification Number (US) 5A002
Leadtime (weeks) 8
2nd Level Interconnect e2
Cache (kByte) 32
Device Weight (g) 10.79630
Description 8360 TBGA ENCRP NO-PB
Application/Qualification Tier COMMERCIAL, INDUSTRIAL
Co Processor Type QUICC
Bus Frequency (Max) (MHz) 133
Core: Number of cores (Spec) 1
Minimum Package Quantity (MPQ) 21
Status Active
Communication Protocol Ethernet / ATM
Maximum Time at Peak Temperature (s) 40
Core: Operating Frequency Max (Max) (MHz) 266
Ethernet 10/100/1000 BaseT
I/O Operating Voltage (Max) (V) 1.9
MPQ Container TRAY
Preferred Order Quantity (POQ) 210
REACH SVHC Freescale REACH Statement
Ambient Operating Temperature (Min-Max) (°C) 0 to 105
External Bus Interface Local / PCI
Peak Package Body Temperature (PPT)(°C) 260
Serial Interface - Type HDLC / I2C / SPI / UART / USB
Package Description and Mechanical Drawing TBGA740 37.5*37.5*1.69P1
Package Length (nominal) (mm) 37.500
Package Width (nominal) (mm) 37.500
Pin/Lead/Ball Count 740
Part Number MPC8358EVVADDEA
USB USB 2.0
Material Type Tested Packaged Device
Moisture Sensitivity Level (MSL) 3
Number of Reflow Cycles 3
Package Thickness (nominal) (mm) 1.460
Device Type MPU
Floor Life 168 HOURS
Halogen Free Yes
RoHS Certificate of Analysis (CoA) Contact Us
Serial Interface - Number of Interfaces 1 / 1 / 2 / 1 / 1
32-bit Product Family Power Architecture
Sample Exception Availability Y

Freescale Semiconductor's MPC8360E PowerQUICC II™ Pro family of integrated communications processors is a next-generation extension of the popular PowerQUICC II line containing cores built on Power Architecture technology. The MPC8360E family incorporates a next-generation communications engine, the QUICC™ Engine, supporting a wide range of protocols, including Gigabit Ethernet and OC-12 asynchronous transfer mode (ATM)/Packet over Sonet (POS). Additional enhancements include the e300 core (enhanced version of the 603e™ core with larger caches), scaling up to 667 MHz, a DDR memory controller and the integrated security engine.

The MPC8360E PowerQUICC II Pro communications processor's advanced features make it suitable for today's and tomorrow's wired and wireless access equipment, as well as small and medium enterprise networking equipment. Target applications include multitenant units (MTUs), digital subscriber line access multiplexers (DSLAMs), wireless basestations, multi and fixed subscriber access nodes, add/drop multiplexers and routers.

The MPC8358E processor, a member of the MPC8360E PowerQUICC II Pro family, is pin-compatible with the MPC8360E (TBGA only). The MPC8358E offers a cost-effective, low-power processing solution that meets the performance requirements for broadband access applications, such as small-to-medium enterprise (SME) routers, low-end DSLAMs and IP private automatic branch exchange (PABX) systems.

e300 System-on-a-Chip Platform
The MPC8358E PowerQUICC II Pro family is based on the e300 system-on-a-chip (SoC) platform. This makes it easy and fast to add or remove functional blocks and develop additional SoC-based family members for emerging markets. At the heart of the e300 SoC platform is Freescale's e300 core built on Power Architecture technology. The e300 core is an enhanced version of the 603e core used in previous-generation PowerQUICC II processors.

Enhancements include twice as much L1 cache (32 KB data cache and 32 KB instruction cache) with integrated parity checking and other performance-enhancing features. The e300 core is software-compatible with existing 603e core-based products.

Connectivity
The MPC8360E processor is designed to support a wide range of communications interfaces, such as MII, RMII, GMII, TBI, RTBI, NMSI, UTOPIA, POS and TDM. The DDR memory controller helps to ensure high-speed memory access and a local system bus operating up to 133 MHz. Additional system connectivity is supplied by dual UART, dual inter-integrated circuit (I2C), dual serial peripheral interface (SPI), PCI interfaces and Universal Serial Bus (USB) interface (USB 2.0 full-/low-speed compatible).

Integrated Security The MPC8360E and MPC8358E processors feature integrated security with the powerful integrated security engine derived from Freescale's security coprocessor product line. Integrated security supports DES, 3DES, MD-5, SHA-1, AES and ARC-4 encryption algorithms, as well as a public key accelerator and an on-chip random number generator. The integrated security engine is capable of single-pass encryption and authentication, as required by IPsec, the IEEE® 802.11i standard and other security protocols.

Typical Applications
DSL infrastructure
  • DSLAMs
  • MTUs
Add/drop multiplexers and digital cross connects

Multiservice access nodes (MSAN) 
Wireless infrastructure