| 速度 |
1.067GHz |
| 处理器类型 |
MPC85xx PowerQUICC III 32-Bit |
| 电压 |
1V |
| 安装类型 |
Surface Mount |
| Cache (kByte) |
32 |
| Device Type |
MPU |
| External Bus Interface |
Local / PCI |
| RoHS Certificate of Analysis (CoA) |
Contact Us |
| Bus Frequency (Max) (MHz) |
166 |
| Package Length (nominal) (mm) |
29.000 |
| Moisture Sensitivity Level (MSL) |
3 |
| Number of Reflow Cycles |
3 |
| Status |
Not Recommended for New Design |
| Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
| Core: Number of cores (Spec) |
1 |
| Pb-Free |
No |
| Core: Type |
e500 |
| Export Control Classification Number (US) |
5A992 |
| Floor Life |
168 HOURS |
| Package Description and Mechanical Drawing |
FCPBGA 783 29SQ2.7P1.0 |
| Description |
PQ38K 8544 |
| Budgetary Price($US) |
100 @ $100.03 each |
| Maximum Time at Peak Temperature (s) |
40 |
| Micron Size (μm) |
.09 |
| Mounting Style |
Surface Mount |
| Sample Exception Availability |
N |
| Part Number |
MPC8544VTARJ |
| Ambient Operating Temperature (Min-Max) (°C) |
0 to 105 |
| Device Weight (g) |
3.53440 |
| External Memory Supported |
DDR / DDR2 / DRAM / SDRAM / SRAM |
| Peak Package Body Temperature (PPT)(°C) |
260 |
| Material Composition Declaration (MCD) |
Download MCD Report |
| Package Material |
Plastic |
| Preferred Order Quantity (POQ) |
180 |
| Device Sample Availability |
21 Aug 2011 |
| Ethernet |
10/100/1000 BaseT |
| REACH SVHC |
Freescale REACH Statement |
| Serial Interface - Number of Interfaces |
2 / 1 / 1 |
| Pin/Lead/Ball Count |
783 |
| 2nd Level Interconnect |
e2 |
| Serial Interface - Type |
I2C / MII / UART |
| L2 Cache (Max) (kByte) |
256 |
| Life Cycle Description (code) |
NOT RECOMMENDED(DECLINING) |
| Package Width (nominal) (mm) |
29.000 |
| 32-bit Product Family |
Power Architecture |
| Minimum Package Quantity (MPQ) |
1 |
| MPQ Container |
TRAY |
| POQ Container |
BOX |
| Tape & Reel |
No |
| Communication Protocol |
Ethernet |
| Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
| Material Type |
Tested Packaged Device |
| RoHS technical exemption(s) |
15 |
| Device Production Availability |
21 Aug 2011 |
| Package Thickness (nominal) (mm) |
2.510 |