| 速度 |
667MHz |
| 处理器类型 |
MPC85xx PowerQUICC III 32-Bit |
| 电压 |
1.2V |
| 安装类型 |
Surface Mount |
| External Bus Interface |
Local / PCI |
| Total DMA Channels |
4 |
| Additional Features |
Encryption Hardware Accelerato |
| POQ Container |
BOX |
| Sample Exception Availability |
Y |
| Part Number |
MPC8555ECPXALF |
| Ambient Operating Temperature (Min-Max) (°C) |
-40 to 105 |
| Communication Protocol |
Ethernet / ATM / HDLC / UTOPIA |
| Core: Operating Frequency Max (Max) (MHz) |
667 |
| Junction Operating Temperature (Max) (°C) |
105 |
| Peak Package Body Temperature (PPT)(°C) |
245 |
| Description |
PQ 37 LITE 8555E |
| Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
| Core: Number of cores (Spec) |
1 |
| Co Processor Frequency (Max) (MHz) |
333 |
| Floor Life |
168 HOURS |
| Junction Operating Temperature (Min) (°C) |
-40 |
| Material Type |
Tested Packaged Device |
| Maximum Time at Peak Temperature (s) |
30 |
| Power Dissipation (Typ) (W) |
6 |
| Serial Interface - Type |
I2C / UART / SPI / Ethernet / SMC / USB / SCC |
| Budgetary Price($US) |
1000 @ $108.06 each |
| Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
| Pb-Free |
No |
| Serial Interface - Number of Interfaces |
2 / 2 / 1 / 2 / 2 / 1 / 3 |
| Co Processor Type |
CPM |
| I/O Operating Voltage (Max) (V) |
2.5 / 3.3 |
| Number of Reflow Cycles |
3 |
| Core: Operating Voltage (Spec) (V) |
1.2 |
| Device Production Availability |
01 Feb 2005 |
| Package Material |
Plastic |
| Preferred Order Quantity (POQ) |
180 |
| RoHS technical exemption(s) |
15 |
| Device Type |
MPU |
| Minimum Package Quantity (MPQ) |
36 |
| REACH SVHC |
Freescale REACH Statement |
| Device Sample Availability |
01 Feb 2005 |
| Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
| RoHS Certificate of Analysis (CoA) |
Contact Us |
| Status |
Active |
| Export Control Classification Number (US) |
5A002 |
| L2 Cache (Max) (kByte) |
256 |
| Package Length (nominal) (mm) |
29.000 |
| Package Thickness (nominal) (mm) |
3.410 |
| Package Width (nominal) (mm) |
29.000 |
| Device Weight (g) |
4.31130 |
| External Memory Supported |
DDR / SDRAM / SRAM |
| Package Description and Mechanical Drawing |
FCPBGA 783 29SQ*3.7P1.0 |
| 32-bit Product Family |
Power Architecture |
| Leadtime (weeks) |
8 |
| Life Cycle Description (code) |
PRODUCT STABLE GROWTH/MATURITY |
| RoHS Compliant |
No |
| Cache (kByte) |
64 |
| Core: Type |
e500 |
| Micron Size (μm) |
.13 |
| Moisture Sensitivity Level (MSL) |
3 |
| MPQ Container |
TRAY |
| Pin/Lead/Ball Count |
783 |
| Power Dissipation (Max) (W) |
7.9 |
| Tape & Reel |
No |
| Core: Performance in MIPS |
1534.1 |
| Ethernet |
10/100 BaseT / 10/100/1000 BaseT / MII |
| Mounting Style |
Surface Mount |