| 系列 |
MSC81xx StarCore |
| 类型 |
SC3400 Core |
| 接口 |
Ethernet, I²C, SPI, TDM, UART, UTOPIA |
| 时钟频率 |
1.0GHz |
| 非易失性存储器 |
External |
| 片上RAM |
10.5MB |
| I/O口电压 |
3.30V |
| 电压 |
1.00V |
| 工作温度 |
0°C ~ 90°C |
| 安装类型 |
Surface Mount |
| Device Type |
MPU |
| Material Composition Declaration (MCD) |
Download MCD Report |
| Preferred Order Quantity (POQ) |
360 |
| RoHS Certificate of Analysis (CoA) |
Contact Us |
| Status |
End of Life |
| Sample Exception Availability |
N |
| 2nd Level Interconnect |
e2 |
| Package Description and Mechanical Drawing |
FCPBGA 783 29SQ3.08P1.0 |
| REACH SVHC |
Freescale REACH Statement |
| Core: Operating Frequency Max (Max) (MHz) |
1000 |
| Ethernet |
10/100/1000 BaseT |
| External Memory Supported |
SRAM / DDR2 / DDR1 / DDR |
| Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
| L2 Cache (Max) (kByte) |
128 |
| Last Ship Date |
17 Jan 2014 |
| Budgetary Price($US) |
100 @ $140.06 each |
| Core: Number of cores (Spec) |
4 |
| Package Length (nominal) (mm) |
29.000 |
| Package Width (nominal) (mm) |
29.000 |
| Tape & Reel |
No |
| Pb-Free |
No |
| Description |
PACSUN REV2.1 1GHZ NON-E QUAL. |
| Additional Features |
Memory Management Unit (MMU) / PLL |
| Device Sample Availability |
16 Jan 2012 |
| Device Weight (g) |
5.51140 |
| Last Order Date |
17 Jan 2013 |
| Export Control Classification Number (US) |
5A992 |
| Micron Size (μm) |
.09 |
| Pin/Lead/Ball Count |
783 |
| Serial Interface - Number of Interfaces |
2 / 8 / 1 / 1 |
| External Bus Interface |
Memory Controller / PCI-Express / RapidIO |
| Minimum Package Quantity (MPQ) |
1 |
| Peak Package Body Temperature (PPT)(°C) |
245 |
| Serial Interface - Type |
SGMII / TDM / UART / I2C |
| Part Number |
MSC8144VT1000B |
| POQ Container |
BOX |
| RoHS technical exemption(s) |
15 |
| Life Cycle Description (code) |
PROD PHASE OUT/SEE LAST ORD DT |
| Moisture Sensitivity Level (MSL) |
3 |
| Number of Reflow Cycles |
3 |
| 32-bit Product Family |
MCORE |
| Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
| Cache (kByte) |
32 |
| Material Type |
Tested Packaged Device |
| Package Thickness (nominal) (mm) |
3.080 |
| Device Production Availability |
16 Jan 2012 |
| Device Production Availability |
30 Apr 2009 |
| Device Sample Availability |
30 Apr 2009 |
| MPQ Container |
EACH |
| Ambient Operating Temperature (Min-Max) (°C) |
0 to 90 |
| Floor Life |
168 HOURS |
| Maximum Time at Peak Temperature (s) |
30 |