系列 |
HC05 |
核心处理器 |
HC05 |
芯体尺寸 |
8-Bit |
速度 |
2.1MHz |
RAM容量 |
176 x 8 |
程序存储器类型 |
OTP |
程序存储器容量 |
4.5KB (4.5K x 8) |
输入/输出数 |
21 |
振荡器型 |
Internal |
数据转换器 |
A/D 4x8b |
连通性 |
SIO |
工作电压 |
3 V ~ 5.5 V |
工作温度 |
-40°C ~ 125°C |
周边设备 |
POR, WDT |
Pin/Lead/Ball Count |
28 |
Description |
MCU, 176 BYTES RAM, A/D, EPP |
Sample Exception Availability |
N |
Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
Peak Package Body Temperature (PPT)(°C) |
260 |
Preferred Order Quantity (POQ) |
2080 |
REACH SVHC |
Freescale REACH Statement |
Leadtime (weeks) |
6 |
Package Material |
Plastic |
Part Number |
MC705P6AMDWE |
Floor Life |
168 HOURS |
Halogen Free |
Yes |
Package Thickness (nominal) (mm) |
2.650 |
Budgetary Price($US) |
10000 @ $2.70 each |
Material Type |
Tested Packaged Device |
RoHS Certificate of Analysis (CoA) |
Contact Us |
Status |
Not Recommended for New Design |
Device Weight (g) |
.75625 |
Material Composition Declaration (MCD) |
Download MCD Report |
2nd Level Interconnect |
e3 |
Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
Export Control Classification Number (US) |
EAR99 |
Minimum Package Quantity (MPQ) |
26 |
Moisture Sensitivity Level (MSL) |
3 |
Mounting Style |
Surface Mount |
Number of Reflow Cycles |
3 |
Package Description and Mechanical Drawing |
SOIC 28W |
UL94 (plastics flammability test) |
V0: burning stops within 10 seconds on a vertical specimen; no drips allowed |
Maximum Height Above Board (mm) |
2.650 |
Package Length (nominal) (mm) |
7.500 |
Micron Size (μm) |
1.2 |
MPQ Container |
RAIL |
Package Width (nominal) (mm) |
17.920 |
POQ Container |
BOX |
Tape & Reel |
No |
Life Cycle Description (code) |
NOT RECOMMENDED(DECLINING) |
Maximum Time at Peak Temperature (s) |
40 |