| P1dB |
30dBm |
| 增益 |
15dB |
| 频率 |
800MHz ~ 2.2GHz |
| 噪声系数 |
5dB |
| 测试频率 |
2.14GHz |
| 电源电压 |
5V |
| 电源电流 |
480mA |
| RF类型 |
Cellular, PCS, PHS, WLL |
| Harmonized Tariff (US) Disclaimer |
8542.33.0000 |
| 2nd Level Interconnect |
e4 |
| Supply Current (Typ) (mA) |
480 |
| Halogen Free |
Yes |
| Peak Package Body Temperature (PPT)(°C) |
260 |
| Supply Voltage (Typ) (V) |
5 |
| Description |
30DBM 15DB GAIN GPA 5X5 PQFN |
| P1dB (Typ) (dBm) |
30 |
| Tape & Reel |
Yes |
| Status |
Active |
| Device Weight (g) |
.15420 |
| Matching |
I/O |
| Maximum Time at Peak Temperature (s) |
40 |
| 3rd Order Intercept (Typ) (dBm) |
47 |
| Budgetary Price($US) |
5000 @ $2.05 each |
| Noise Figure (Typ) (dB) @ f (MHz) |
5 @ 2140 |
| Output Power (Typ) (dBm) @ f (MHz) |
30 @ 2140 |
| Power Gain (Typ) (dB) @ f (MHz) |
15 @ 2140 |
| Export Control Classification Number (US) |
EAR99 |
| Frequency (Max) (MHz) |
2200 |
| UL94 (plastics flammability test) |
V0: burning stops within 10 seconds on a vertical specimen; no drips allowed |
| MPQ Container |
REEL |
| Package Description and Mechanical Drawing |
PWR QFN 16 5*5*2.1P0.8 |
| Pin/Lead/Ball Count |
16 |
| Preferred Order Quantity (POQ) |
1000 |
| Sample Exception Availability |
Y |
| Micron Size (μm) |
2 |
| RoHS Certificate of Analysis (CoA) |
Contact Us |
| Frequency Band (Min-Max) (MHz) |
800 to 2200 |
| Material Composition Declaration (MCD) |
Download MCD Report |
| Moisture Sensitivity Level (MSL) |
3 |
| Package Thickness (nominal) (mm) |
2.100 |
| Floor Life |
168 HOURS |
| Number of Reflow Cycles |
3 |
| Class |
A |
| Material Type |
Tested Packaged Device |
| Minimum Package Quantity (MPQ) |
1000 |
| Package Length (nominal) (mm) |
5.000 |
| Package Width (nominal) (mm) |
5.000 |
| POQ Container |
REEL |
| Leadtime (weeks) |
8 |
| Life Cycle Description (code) |
PRODUCT MATURITY/SATURATION |
| Mounting Style |
Surface Mount |
| Thermal Resistance (Spec) (°CW) |
21.5 |
| Part Number |
MMG3005NT1 |
| Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
| REACH SVHC |
Freescale REACH Statement |
| Die Technology |
InGaP HBT |
| Package Material |
Plastic |