| Device Weight (g) |
.71455 |
| Die Technology |
LDMOS |
| Moisture Sensitivity Level (MSL) |
3 |
| MPQ Container |
REEL |
| Number of Reflow Cycles |
3 |
| Description |
2.1GHZ IPA PFP16N |
| Status |
Not Recommended for New Design |
| Material Type |
Tested Packaged Device |
| Wideband Efficiency (Typ) (%) |
45 |
| Part Number |
MHV5IC2215NR2 |
| Floor Life |
168 HOURS |
| RoHS Certificate of Analysis (CoA) |
Download RoHS CoA Report |
| RoHS technical exemption(s) |
7a |
| Gain (Typ) (dB) |
24 |
| Output Power (Typ) (W) (P1dB) |
15 |
| P1dB (Typ) (W) |
15 |
| Peak Package Body Temperature (PPT)(°C) |
260 |
| Device Production Availability |
25 Mar 2011 |
| Package Description and Mechanical Drawing |
PFP-16 |
| REACH SVHC |
Freescale REACH Statement |
| Frequency Band (Min-Max) (MHz) |
1930 to 1990 |
| Maximum Time at Peak Temperature (s) |
40 |
| Power Gain (Typ) (dB) @ f (MHz) |
27.5 @ 1960 |
| Tape & Reel |
Yes |
| Wideband Frequency (Min-Max) (MHz) (f) |
1250 to 2500 |
| Efficiency (Typ) (%) |
45 |
| Test Signal |
N-CDMA |
| Class |
AB |
| Device Sample Availability |
25 Mar 2011 |
| Pin/Lead/Ball Count |
16 |
| POQ Container |
BOX |
| Supply Voltage (Typ) (V) |
28 |
| Device Production Availability |
07 Jun 2005 |
| Leadtime (weeks) |
8 |
| Mounting Style |
Surface Mount |
| Output Power (Typ) (W) @ Intermodulation Level at Test Signal |
0.2 @ CW |
| Package Length (nominal) (mm) |
7.000 |
| Package Width (nominal) (mm) |
7.000 |
| Sample Exception Availability |
N |
| Export Control Classification Number (US) |
5A991 |
| Life Cycle Description (code) |
NOT RECOMMENDED(DECLINING) |
| Micron Size (μm) |
.37 |
| Minimum Package Quantity (MPQ) |
1500 |
| Material Composition Declaration (MCD) |
Download MCD Report |
| Package Material |
Plastic |
| Budgetary Price($US) |
- |
| Device Sample Availability |
07 Jun 2005 |
| Preferred Order Quantity (POQ) |
1500 |
| 2nd Level Interconnect |
e4 |
| Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
| Matching |
I/O |
| Application |
N-CDMA |
| Pb-Free |
No |
| Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
| Frequency (Max) (MHz) |
1990 |
| Package Thickness (nominal) (mm) |
2.300 |
| Thermal Resistance (Spec) (°CW) |
3.5 |