| 2nd Level Interconnect |
e3 |
| Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
| Class |
A |
| Material Type |
Tested Packaged Device |
| Minimum Package Quantity (MPQ) |
1000 |
| Package Length (nominal) (mm) |
4.500 |
| Sample Exception Availability |
Y |
| Tape & Reel |
Yes |
| Die Technology |
InGaP HBT |
| Frequency (Max) (MHz) |
6000 |
| Package Thickness (nominal) (mm) |
1.500 |
| Device Weight (g) |
.05080 |
| Peak Package Body Temperature (PPT)(°C) |
260 |
| Preferred Order Quantity (POQ) |
8000 |
| Supply Current (Typ) (mA) |
90 |
| 3rd Order Intercept (Typ) (dBm) |
37 |
| Budgetary Price($US) |
5000 @ $0.67 each |
| Frequency Band (Min-Max) (MHz) |
0 to 6000 |
| Package Width (nominal) (mm) |
2.500 |
| RoHS Certificate of Analysis (CoA) |
Contact Us |
| Output Power (Typ) (dBm) @ f (MHz) |
20.5 @ 900 |
| REACH SVHC |
Freescale REACH Statement |
| P1dB (Typ) (dBm) |
20.5 |
| Package Description and Mechanical Drawing |
SOT-89 4.5*2.5*1.55P1.5 |
| Floor Life |
UNLIMITED |
| Harmonized Tariff (US) Disclaimer |
8542.33.0000 |
| Micron Size (μm) |
1 |
| Moisture Sensitivity Level (MSL) |
1 |
| POQ Container |
BOX |
| Noise Figure (Typ) (dB) @ f (MHz) |
5.5 @ 900 |
| Package Material |
Plastic |
| Pin/Lead/Ball Count |
4 |
| Device Production Availability |
11 Apr 2008 |
| Material Composition Declaration (MCD) |
Download MCD Report |
| Description |
20.5DBM 19.5DB GPA SOT89 |
| Maximum Time at Peak Temperature (s) |
40 |
| Power Gain (Typ) (dB) @ f (MHz) |
19.3 @ 900 |
| Part Number |
MMG3H21NT1 |
| Status |
Active |
| Export Control Classification Number (US) |
EAR99 |
| Life Cycle Description (code) |
PRODUCT STABLE GROWTH/MATURITY |
| Mounting Style |
Surface Mount |
| MPQ Container |
REEL |
| Supply Voltage (Typ) (V) |
5 |
| Device Sample Availability |
11 Apr 2008 |
| Number of Reflow Cycles |
3 |
| Thermal Resistance (Spec) (°CW) |
38.6 |