Class |
AB |
Output Power (Typ) (W) @ Intermodulation Level at Test Signal |
8 @ CW |
Power Gain (Typ) (dB) @ f (MHz) |
13 @ 520 |
Budgetary Price($US) |
- |
Device Weight (g) |
.28000 |
Micron Size (μm) |
1 |
Package Material |
Plastic |
Test Signal |
1-Tone |
Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
Package Width (nominal) (mm) |
6.600 |
Pb-Free |
No |
Thermal Resistance (Spec) (°CW) |
2 |
Description |
RF LDMOS FET PLD1.5N |
Export Control Classification Number (US) |
EAR99 |
Floor Life |
168 HOURS |
Frequency (Max) (MHz) |
520 |
P1dB (Typ) (W) |
8 |
RoHS technical exemption(s) |
7a |
Leadtime (weeks) |
8 |
Life Cycle Description (code) |
PRODUCT MATURITY/SATURATION |
Supply Voltage (Typ) (V) |
12.5 |
Part Number |
MRF1518NT1 |
REACH SVHC |
Freescale REACH Statement |
RoHS Certificate of Analysis (CoA) |
Contact Us |
Wideband Frequency (Min-Max) (MHz) (f) |
400 to 520 |
Status |
Active |
Device Production Availability |
01 Mar 2005 |
Maximum Time at Peak Temperature (s) |
40 |
Package Length (nominal) (mm) |
5.850 |
Tape & Reel |
Yes |
Device Sample Availability |
01 Mar 2005 |
Package Thickness (nominal) (mm) |
1.740 |
Die Technology |
LDMOS |
Moisture Sensitivity Level (MSL) |
3 |
MPQ Container |
REEL |
Number of Reflow Cycles |
3 |
Preferred Order Quantity (POQ) |
1000 |
Sample Exception Availability |
Y |
Frequency Band (Min-Max) (MHz) |
400 to 520 |
Matching |
Unmatched |
Peak Package Body Temperature (PPT)(°C) |
260 |
2nd Level Interconnect |
e3 |
Efficiency (Typ) (%) |
60 |
Material Type |
Tested Packaged Device |
Minimum Package Quantity (MPQ) |
1000 |
Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
Harmonized Tariff (US) Disclaimer |
8541.29.0075 |
Wideband Efficiency (Typ) (%) |
55 |
Package Description and Mechanical Drawing |
PLD-1.5 |
Pin/Lead/Ball Count |
4 |
POQ Container |
BOX |