| 2nd Level Interconnect |
e3 |
| Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
| Class |
AB |
| Die Technology |
LDMOS |
| Export Control Classification Number (US) |
EAR99 |
| Frequency (Max) (MHz) |
470 |
| Frequency Band (Min-Max) (MHz) |
400 to 470 |
| Harmonized Tariff (US) Disclaimer |
8541.21.0075 |
| Life Cycle Description (code) |
PRODUCT MATURITY/SATURATION |
| Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
| Micron Size (μm) |
1 |
| Pin/Lead/Ball Count |
8 |
| RoHS Certificate of Analysis (CoA) |
Contact Us |
| Sample Exception Availability |
Y |
| Supply Voltage (Typ) (V) |
12.5 |
| Minimum Package Quantity (MPQ) |
500 |
| POQ Container |
REEL |
| Floor Life |
168 HOURS |
| Matching |
Unmatched |
| Moisture Sensitivity Level (MSL) |
3 |
| P1dB (Typ) (W) |
70 |
| Test Signal |
1-Tone |
| Package Material |
Plastic |
| Mounting Style |
Surface Mount |
| Wideband Efficiency (Typ) (%) |
50 |
| Wideband Frequency (Min-Max) (MHz) (f) |
400 to 470 |
| Material Type |
Tested Packaged Device |
| Maximum Time at Peak Temperature (s) |
40 |
| MPQ Container |
REEL |
| Number of Reflow Cycles |
3 |
| REACH SVHC |
Freescale REACH Statement |
| RoHS technical exemption(s) |
7a |
| UL94 (plastics flammability test) |
V0: burning stops within 10 seconds on a vertical specimen; no drips allowed |
| Description |
RF LDMOS TO272-6N FORMED |
| Package Width (nominal) (mm) |
23.670 |
| Preferred Order Quantity (POQ) |
500 |
| Thermal Resistance (Spec) (°CW) |
0.29 |
| Budgetary Price($US) |
- |
| Status |
Active |
| Tape & Reel |
Yes |
| Part Number |
MRF1570NT1 |
| Device Weight (g) |
1.27740 |
| Peak Package Body Temperature (PPT)(°C) |
260 |
| Package Length (nominal) (mm) |
6.400 |
| Package Thickness (nominal) (mm) |
2.740 |
| Package Description and Mechanical Drawing |
TO-272-8 WRAP |
| Pb-Free |
No |
| Efficiency (Typ) (%) |
60 |
| Power Gain (Typ) (dB) @ f (MHz) |
11.5 @ 470 |
| Output Power (Typ) (W) @ Intermodulation Level at Test Signal |
70 @ CW |
| Device Sample Availability |
29 May 2004 |
| Device Production Availability |
29 May 2004 |