Part Number |
MRF21030LR3 |
Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
Package Description and Mechanical Drawing |
NI-400 |
Matching |
I/O |
Maximum Time at Peak Temperature (s) |
40 |
Sample Exception Availability |
N |
Tape & Reel |
Yes |
Device Weight (g) |
3.69820 |
Frequency (Max) (MHz) |
2170 |
Last Ship Date |
27 Jun 2013 |
Minimum Package Quantity (MPQ) |
250 |
REACH SVHC |
Freescale REACH Statement |
Device Production Availability |
21 Jun 2011 |
Export Control Classification Number (US) |
5A991 |
Halogen Free |
Yes |
Intermodulation Distortion - IMD (Typ) (dBc) |
-30 |
Supply Voltage (Typ) (V) |
28 |
Package Width (nominal) (mm) |
9.780 |
Test Signal |
2-Tone |
2nd Level Interconnect |
e4 |
Frequency Band (Min-Max) (MHz) |
2110 to 2170 |
Package Length (nominal) (mm) |
20.320 |
Peak Package Body Temperature (PPT)(°C) |
260 |
Pin/Lead/Ball Count |
2 |
Device Sample Availability |
22 Oct 2003 |
Die Technology |
LDMOS |
Micron Size (μm) |
6 |
MPQ Container |
REEL |
Thermal Resistance (Spec) (°CW) |
2.1 |
Life Cycle Description (code) |
PRODUCT LAST SHIPMENTS |
Output Power (Typ) (W) @ Intermodulation Level at Test Signal |
30 @ PEP |
Description |
30W 2.2GHZ LDMOS NI400L |
Number of Reflow Cycles |
3 |
Power Gain (Typ) (dB) @ f (MHz) |
13 @ 2170 |
Last Order Date |
27 Jun 2012 |
RoHS Certificate of Analysis (CoA) |
Contact Us |
Class |
AB |
Device Production Availability |
22 Oct 2003 |
Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
P1dB (Typ) (W) |
30 |
Status |
No Longer Manufactured |
Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
Material Type |
Tested Packaged Device |
Budgetary Price($US) |
- |
Device Sample Availability |
21 Jun 2011 |
Efficiency (Typ) (%) |
33 |
Package Thickness (nominal) (mm) |
3.660 |