Device Production Availability |
22 Oct 2003 |
Description |
RF PWR LDMOS NI400LS |
Device Production Availability |
15 Jun 2010 |
Efficiency (Typ) (%) |
23.5 |
Leadtime (weeks) |
8 |
Material Type |
Tested Packaged Device |
Package Thickness (nominal) (mm) |
3.660 |
POQ Container |
REEL |
Output Power (Typ) (W) @ Intermodulation Level at Test Signal |
10 @ AVG |
Package Description and Mechanical Drawing |
NI-400S |
Power Gain (Typ) (dB) @ f (MHz) |
15 @ 2157.5 |
RoHS Certificate of Analysis (CoA) |
Contact Us |
Package Length (nominal) (mm) |
10.160 |
Package Width (nominal) (mm) |
10.160 |
Thermal Resistance (Spec) (°CW) |
1.65 |
Class |
AB |
Life Cycle Description (code) |
PROD PHASE OUT/SEE LAST ORD DT |
Supply Voltage (Typ) (V) |
28 |
Part Number |
MRF21045LSR3 |
Export Control Classification Number (US) |
5A991 |
Intermodulation Distortion - IM3 (Typ) (dBc) |
-37.5 |
Last Ship Date |
30 Jun 2012 |
Number of Reflow Cycles |
3 |
Test Signal |
W-CDMA |
Die Technology |
LDMOS |
Micron Size (μm) |
6 |
Device Sample Availability |
22 Oct 2003 |
MPQ Container |
REEL |
Preferred Order Quantity (POQ) |
250 |
Device Weight (g) |
2.52030 |
Tape & Reel |
Yes |
Status |
End of Life |
Halogen Free |
Yes |
Peak Package Body Temperature (PPT)(°C) |
260 |
Pin/Lead/Ball Count |
3 |
Sample Exception Availability |
N |
Frequency Band (Min-Max) (MHz) |
2110 to 2170 |
Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
Matching |
I/O |
Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
Maximum Time at Peak Temperature (s) |
40 |
2nd Level Interconnect |
e4 |
Budgetary Price($US) |
- |
Device Sample Availability |
15 Jun 2010 |
Minimum Package Quantity (MPQ) |
250 |
Frequency (Max) (MHz) |
2170 |
Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
Last Order Date |
01 Jul 2011 |
P1dB (Typ) (W) |
45 |
REACH SVHC |
Freescale REACH Statement |