Description |
HV5 LDMOS WCDMA NI880 |
Frequency Band (Min-Max) (MHz) |
2110 to 2170 |
Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
Matching |
I/O |
Peak Package Body Temperature (PPT)(°C) |
260 |
Device Production Availability |
23 Oct 2003 |
Export Control Classification Number (US) |
5A991 |
Micron Size (μm) |
6 |
Package Thickness (nominal) (mm) |
.200 |
Test Signal |
W-CDMA |
Last Order Date |
03 Oct 2008 |
Life Cycle Description (code) |
PRODUCT LAST SHIPMENTS |
REACH SVHC |
Freescale REACH Statement |
Device Production Availability |
15 Apr 2006 |
Device Weight (g) |
9.73370 |
Last Ship Date |
14 May 2009 |
Thermal Resistance (Spec) (°CW) |
0.44 |
Class |
AB |
Supply Voltage (Typ) (V) |
28 |
Part Number |
MRF5S21130HR3 |
Device Sample Availability |
15 Apr 2006 |
Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
Device Sample Availability |
23 Oct 2003 |
RoHS Certificate of Analysis (CoA) |
Contact Us |
Tape & Reel |
Yes |
Halogen Free |
Yes |
Intermodulation Distortion - IM3 (Typ) (dBc) |
-37 |
Maximum Time at Peak Temperature (s) |
40 |
Package Length (nominal) (mm) |
1.340 |
Pin/Lead/Ball Count |
3 |
Sample Exception Availability |
N |
Die Technology |
LDMOS |
Package Width (nominal) (mm) |
.540 |
MPQ Container |
REEL |
Number of Reflow Cycles |
3 |
Power Gain (Typ) (dB) @ f (MHz) |
13.5 @ 2170 |
Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
Efficiency (Typ) (%) |
26 |
Frequency (Max) (MHz) |
2170 |
Budgetary Price($US) |
- |
Minimum Package Quantity (MPQ) |
250 |
Output Power (Typ) (W) @ Intermodulation Level at Test Signal |
28 @ AVG |
P1dB (Typ) (W) |
100 |
Status |
No Longer Manufactured |
2nd Level Interconnect |
e4 |
Material Type |
Tested Packaged Device |
Package Description and Mechanical Drawing |
NI-880 |