Die Technology |
LDMOS |
Last Ship Date |
14 May 2009 |
Micron Size (μm) |
6 |
Output Power (Typ) (W) @ Intermodulation Level at Test Signal |
33 @ AVG |
Device Sample Availability |
08 Feb 2007 |
Material Type |
Tested Packaged Device |
Frequency (Max) (MHz) |
960 |
RoHS Certificate of Analysis (CoA) |
Contact Us |
Harmonized Tariff (US) Disclaimer |
8541.29.0075 |
Peak Package Body Temperature (PPT)(°C) |
Not Available |
Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
Power Gain (Typ) (dB) @ f (MHz) |
19.7 @ 880 |
Test Signal |
N-CDMA |
Class |
AB |
Device Production Availability |
08 Feb 2007 |
Device Weight (g) |
6.41040 |
Frequency Band (Min-Max) (MHz) |
880 to 960 |
Package Thickness (nominal) (mm) |
3.760 |
Package Width (nominal) (mm) |
9.780 |
Export Control Classification Number (US) |
EAR99 |
P1dB (Typ) (W) |
150 |
Status |
No Longer Manufactured |
Budgetary Price($US) |
- |
Efficiency (Typ) (%) |
28.4 |
Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
Supply Voltage (Typ) (V) |
28 |
Part Number |
MRF5S9150HR3 |
2nd Level Interconnect |
e4 |
Last Order Date |
03 Oct 2008 |
Life Cycle Description (code) |
REMOVED FROM ACTIVE PORTFOLIO |
REACH SVHC |
Freescale REACH Statement |
Tape & Reel |
Yes |
Thermal Resistance (Spec) (°CW) |
0.34 |
Halogen Free |
Yes |
Package Description and Mechanical Drawing |
NI-780 |
Pin/Lead/Ball Count |
3 |
Matching |
Input |
Description |
HV5 900MHZ 150W NI780H |
Package Length (nominal) (mm) |
34.040 |
Sample Exception Availability |
N |