Preferred Order Quantity (POQ) |
250 |
Test Signal |
W-CDMA |
Efficiency (Typ) (%) |
27.7 |
Export Control Classification Number (US) |
EAR99 |
2nd Level Interconnect |
e4 |
Budgetary Price($US) |
- |
Minimum Package Quantity (MPQ) |
250 |
P1dB (Typ) (W) |
50 |
Package Thickness (nominal) (mm) |
3.660 |
Micron Size (μm) |
6 |
Status |
Active |
Device Sample Availability |
02 Mar 2005 |
Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
Matching |
I/O |
Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
Maximum Time at Peak Temperature (s) |
40 |
Package Length (nominal) (mm) |
20.320 |
RoHS Certificate of Analysis (CoA) |
Contact Us |
Tape & Reel |
Yes |
Part Number |
MRF6S21050LR3 |
Class |
AB |
Output Power (Typ) (W) @ Intermodulation Level at Test Signal |
11.5 @ AVG |
Supply Voltage (Typ) (V) |
28 |
Description |
HV6 W-CDMA 11.5W NI400L |
Halogen Free |
Yes |
Thermal Resistance (Spec) (°CW) |
1.28 |
Intermodulation Distortion - IM3 (Typ) (dBc) |
-37 |
Leadtime (weeks) |
8 |
Life Cycle Description (code) |
PRODUCT MATURITY/SATURATION |
Device Weight (g) |
3.69590 |
Die Technology |
LDMOS |
MPQ Container |
REEL |
Number of Reflow Cycles |
3 |
Pin/Lead/Ball Count |
2 |
Power Gain (Typ) (dB) @ f (MHz) |
16 @ 2170 |
Sample Exception Availability |
Y |
Frequency Band (Min-Max) (MHz) |
2110 to 2170 |
Package Description and Mechanical Drawing |
NI-400 |
Peak Package Body Temperature (PPT)(°C) |
260 |
Material Type |
Tested Packaged Device |
POQ Container |
REEL |
Device Production Availability |
02 Mar 2005 |
Frequency (Max) (MHz) |
2170 |
Package Width (nominal) (mm) |
9.780 |
Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
REACH SVHC |
Freescale REACH Statement |