Micron Size (μm) |
6 |
Status |
No Longer Manufactured |
2nd Level Interconnect |
e4 |
Last Ship Date |
30 Jun 2012 |
Life Cycle Description (code) |
REMOVED FROM ACTIVE PORTFOLIO |
Material Type |
Tested Packaged Device |
Number of Reflow Cycles |
3 |
Package Length (nominal) (mm) |
20.570 |
Peak Package Body Temperature (PPT)(°C) |
260 |
Part Number |
MRF6V10250HSR3 |
Class |
AB |
Export Control Classification Number (US) |
EAR99 |
Power Gain (Typ) (dB) @ f (MHz) |
21 @ 1090 |
Package Width (nominal) (mm) |
9.780 |
Device Weight (g) |
4.76300 |
Frequency Band (Min-Max) (MHz) |
1030 to 1090 |
Device Production Availability |
15 Jun 2010 |
Last Order Date |
01 Jul 2011 |
P1dB (Typ) (W) |
250 |
Package Description and Mechanical Drawing |
NI-780S |
REACH SVHC |
Freescale REACH Statement |
Device Sample Availability |
15 Jun 2010 |
Efficiency (Typ) (%) |
60 |
Sample Exception Availability |
N |
Description |
VHV6 250W AVIONIC NI780S |
Matching |
I/O |
Test Signal |
Pulse |
RoHS Certificate of Analysis (CoA) |
Contact Us |
Maximum Time at Peak Temperature (s) |
40 |
Tape & Reel |
Yes |
Thermal Resistance (Spec) (°CW) |
0.1 |
Frequency (Max) (MHz) |
1090 |
Output Power (Typ) (W) @ Intermodulation Level at Test Signal |
250 @ Peak |
Die Technology |
LDMOS |
Supply Voltage (Typ) (V) |
50 |
Halogen Free |
Yes |
Package Thickness (nominal) (mm) |
3.760 |
Pin/Lead/Ball Count |
3 |
Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
Harmonized Tariff (US) Disclaimer |
8541.29.0075 |
Budgetary Price($US) |
- |
Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |