| Material Composition Declaration (MCD) |
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| Description |
HV7 1.9GHZ 28V63W NI780S |
| Matching |
I/O |
| Peak Package Body Temperature (PPT)(°C) |
Not Available |
| Package Width (nominal) (mm) |
9.780 |
| REACH SVHC |
Freescale REACH Statement |
| Micron Size (μm) |
6 |
| Test Signal |
W-CDMA |
| Class |
AB |
| Export Control Classification Number (US) |
EAR99 |
| Power Gain (Typ) (dB) @ f (MHz) |
20 @ 1990 |
| Supply Voltage (Typ) (V) |
28 |
| Thermal Resistance (Spec) (°CW) |
0.38 |
| Status |
No Longer Manufactured |
| Frequency Band (Min-Max) (MHz) |
1930 to 1990 |
| Budgetary Price($US) |
- |
| Efficiency (Typ) (%) |
29 |
| Maximum Time at Peak Temperature (s) |
40 |
| Device Weight (g) |
4.76300 |
| Package Description and Mechanical Drawing |
NI-780S |
| Package Length (nominal) (mm) |
20.570 |
| Frequency (Max) (MHz) |
1990 |
| Tape & Reel |
Yes |
| Halogen Free |
Yes |
| P1dB (Typ) (W) |
190 |
| Pin/Lead/Ball Count |
3 |
| RoHS Certificate of Analysis (CoA) |
Contact Us |
| Sample Exception Availability |
N |
| Part Number |
MRF7S19210HSR3 |
| Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
| Die Technology |
LDMOS |
| Material Type |
Tested Packaged Device |
| Number of Reflow Cycles |
3 |
| Output Power (Typ) (W) @ Intermodulation Level at Test Signal |
63 @ AVG |
| Device Production Availability |
15 Jun 2010 |
| Harmonized Tariff (US) Disclaimer |
8541.29.0075 |
| Package Thickness (nominal) (mm) |
3.760 |
| 2nd Level Interconnect |
e4 |
| Device Sample Availability |
15 Jun 2010 |
| Life Cycle Description (code) |
REMOVED FROM ACTIVE PORTFOLIO |