| Core: Operating Voltage (Spec) (V) |
5 |
| Device Function |
H-Bridge and Config Switches / High Side Switch / Network Transceivers / System Basis Chip / Embedded MCU plus Power |
| Device Sample Availability |
30 Mar 2011 |
| Package Material |
Plastic |
| Pin/Lead/Ball Count |
54 |
| Data Rate (Min) (kbps) |
10 |
| Life Cycle Description (code) |
PRODUCT RAPID GROWTH |
| Preferred Order Quantity (POQ) |
1040 |
| Material Type |
Tested Packaged Device |
| Floor Life |
168 HOURS |
| MPQ Container |
RAIL |
| RoHS Certificate of Analysis (CoA) |
Contact Us |
| Sample Exception Availability |
Y |
| Part Number |
MM908E622ACPEK |
| Additional Features-Analog |
PWM Capable / Internal Charge Pump |
| Core: Type |
HC08 |
| Data Rate (Spec) (kbps) |
100 |
| POQ Container |
BOX |
| Internal RAM (kByte) |
0.5 |
| REACH SVHC |
Freescale REACH Statement |
| 2nd Level Interconnect |
e3 |
| Core: Number of cores (Spec) |
1 |
| Core: Operating Frequency Max (Max) (MHz) |
8 |
| Budgetary Price($US) |
10000 @ $5.57 each |
| Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
| Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL, AUTOMOTIVE |
| Device Production Availability |
30 Jun 2011 |
| Halogen Free |
Yes |
| Load Supply Voltage (Max) (V) |
20 |
| Load Supply Voltage (Min) (V) |
7.5 |
| Package Width (nominal) (mm) |
10.300 |
| Peak Package Body Temperature (PPT)(°C) |
260 |
| Tape & Reel |
No |
| Description |
QUAD H-B, TRIHS,EC GLASS |
| Data Rate (Max) (kbps) |
20 |
| Export Control Classification Number (US) |
EAR99 |
| Micron Size (μm) |
.65 |
| Package Length (nominal) (mm) |
5.100 |
| Package Thickness (nominal) (mm) |
2.450 |
| Supply Voltage (Min-Max) (V) |
5 to 28 |
| Device Weight (g) |
.84770 |
| Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
| Protection |
Over Temperature / Overvoltage / Over Current / Cross-Conduction Suppression / Short Circuit / Undervoltage Detect |
| Status |
Active |
| Communication Protocol |
LIN |
| Diagnostics |
SPI |
| Maximum Time at Peak Temperature (s) |
40 |
| Package Description and Mechanical Drawing |
SOIC 54 300ML 5*10EP |
| Ambient Operating Temperature (Min-Max) (°C) |
-40 to 85 |
| Minimum Package Quantity (MPQ) |
26 |
| Moisture Sensitivity Level (MSL) |
3 |
| Number of Reflow Cycles |
3 |
| UL94 (plastics flammability test) |
V0: burning stops within 10 seconds on a vertical specimen; no drips allowed |
| Internal Flash (kByte) |
16 |
| Mounting Style |
Surface Mount |