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ACM2012-121-2P-T002

厂商:
TDK
类别:
共模滤波器
包装:
Blister (Plastic)Taping [180mm Reel]
封装:
-
无铅情况/ROHS:
-
描述:
-

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  • 参数
  • 描述
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参数 数值
共模阻抗-Min 90Ohm
保存温度范围-Min -25Cel
使用温度范围-Min -25Cel
直流电阻-Max 0.22Ohm
尺寸代码 2012
重量-Nom 0.01g
包装形式 Blister (Plastic)Taping [180mm Reel]
主体横宽(L)-Nom 2 mm
形状 Chip
AC/DC分类 DC
主体纵长(W)-Nom 1.2 mm
主体高度(T)-Nom 1.2 mm
最少供货数-Nom 2000Pcs
共模阻抗-Typ 120Ohm
元件数(电路数)-Nom 2
最少包装数-Nom 2000Pcs
使用温度范围-Max 85Cel
保存温度范围-Max 85Cel
适用焊接方法 Reflow,Iron Soldering
线数-Nom 2
共模阻抗测定频率-Nom 100 MHz
额定电压-Max 50V
绝缘电阻-Min 10 MOhm
表面安装分类 Yes
额定电流-Max 370 mA

The SAM3S1B is a member of the Atmel® SAM3S series microcontrollers based on the high-performance 32-bit ARM® Cortex™-M3 RISC processor. It operates at a maximum speed of 64MHz and features 64KB of flash and 16KB of SRAM. The extensive peripheral set includes a FS USB Device port with embedded transceiver, a HS multimedia card interface for SDIO/SD/MMC, two USARTs, two UARTs, two TWIs, three SPI, I2S, PWM timer, three 16-bit timers, RTC, 10x12-bit ADC, 2x12-bit DAC and an analog comparator. The SAM3S1B is ready for capacitive touch thanks to the QTouch® library, offering an easy way to implement buttons, wheels and sliders. The parallel data capture mode on the PIOs collects data from external devices not compliant with standard memory read protocols, such as low-cost image sensors. The data is then transferred to memory by DMA offloading the CPU. It operates from 1.62V to 3.6V and is available in 64-pin QFP and QFN packages. The SAM3S1B is pin-to-pin compatible with the SAM3N1B and SAM7S64.

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